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M Rymaszewski

M Rymaszewski

15 results found
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1.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,522
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 18-20 Days Explain..
2.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED924
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED194
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 10-12 Days Explain..
4.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED923
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED693
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer My Copy UK
No Review Yet
AED96
Binding:
Paperback
Release:
31 Jan 1997
Out of Stock
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7.
Sid Meier's Civilization II
Sid Meier's Civilization II
By: M Rymaszewski
Publisher: Prima Publishing,U.S.
No Review Yet
AED68
Binding:
Paperback
Release:
23 Oct 1996
Language:
English
Out of Stock
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8.
"Command & Conquer" Revised Secrets
By: M Rymaszewski
Publisher: Prima Publishing,U.S.
No Review Yet
AED69
Binding:
Paperback
Release:
19 Jun 1996
Language:
English
Out of Stock
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9.
Microelectronics Packaging Handbook, 3-part set
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,160
Binding:
Book
Release:
31 Jan 1997
Language:
English
Out of Stock
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10.
Second-Level Microelectronics Packaging
Second-Level Microelectronics Packaging
By: Rao Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED170
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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11.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED114
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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12.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED152
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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13.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED189
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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14.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED362
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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15.
Microelectronics Packaging Fundamentals
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein
Publisher: Chapman and Hall
No Review Yet
AED257
Binding:
Hardback
Release:
/03/1998
Language:
English
Out of Stock
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