Buy books written by M Rymaszewski Available at Bookswagon
Logo1
close menu
Bookswagon
search
My Account
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
humburger icon Categories

Refine your Search

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
M Rymaszewski

M Rymaszewski

15 results found
Filter0Switch to Grid View
List viewGrid view
Sort By:
1.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,401
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 18-20 Days Explain..
2.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED897
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED897
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED193
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 10-12 Days Explain..
5.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED673
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer My Copy UK
No Review Yet
AED88
Binding:
Paperback
Release:
31 Jan 1997
Out of Stock
Notify me when this book is in stockNotify Me
7.
"Command & Conquer" Revised Secrets
By: M Rymaszewski
Publisher: Prima Publishing,U.S.
No Review Yet
AED63
Binding:
Paperback
Release:
19 Jun 1996
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
8.
Sid Meier's Civilization II
Sid Meier's Civilization II
By: M Rymaszewski
Publisher: Prima Publishing,U.S.
No Review Yet
AED63
Binding:
Paperback
Release:
23 Oct 1996
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
9.
Microelectronics Packaging Handbook, 3-part set
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,067
Binding:
SA
Release:
31 Jan 1997
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
10.
Second-Level Microelectronics Packaging
Second-Level Microelectronics Packaging
By: Rao Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED156
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
11.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED139
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
12.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED174
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
13.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED332
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
14.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED105
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
15.
Microelectronics Packaging Fundamentals
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein
Publisher: Chapman and Hall
No Review Yet
AED237
Binding:
Hardback
Release:
/03/1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found