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E.J. Rymaszewski

E.J. Rymaszewski

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1.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED396
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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2.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED125
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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3.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED166
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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4.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED207
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
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5.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
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AED369
Binding:
Hardback
Release:
/01/1996
Language:
English
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6.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski
Publisher: Kluwer Academic Publishers Group
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AED369
Binding:
Hardback
Release:
/12/1988
Language:
English
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7.
Microelectronics Packaging Fundamentals
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein
Publisher: Chapman and Hall
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AED282
Binding:
Hardback
Release:
/03/1998
Language:
English
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