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Rao Tummala

Rao Tummala Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the enire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM. Read More Read Less

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1.
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
By: Rao Tummala
Publisher: McGraw-Hill Education
No Review Yet
AED961
Binding:
Hardback
Release:
18 Aug 2019
Language:
English
International Edition
Ships within 10-12 Days Explain..
2.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
By: Tummala, Rao R.
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AED91
Binding:
Paperback
Language:
English
Available
Ships within 2-4 Days Explain..
3.
System on Package
System on Package
By: Rao Tummala
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED670
Binding:
Hardback
Release:
16 Jun 2008
Language:
English
International Edition
Ships within 10-12 Days Explain..
4.
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
By: Rao Tummala
Publisher: McGraw Hill Education India
No Review Yet
AED361
Binding:
Digital (delivered electronically)
Release:
20 Nov 2019
Language:
English
Out of Stock
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5.
System on Package: Miniaturization of the Entire System
System on Package: Miniaturization of the Entire System
By: Rao Tummala
Publisher: McGraw-Hill Companies
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AED79
Binding:
Digital (delivered electronically)
Release:
01 Jan 2008
Out of Stock
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6.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao Tummala
Publisher: McGraw-Hill Professional Publishing
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AED581
Binding:
Digital (delivered electronically)
Release:
08 May 2001
Language:
English
Out of Stock
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7.
System on Package
System on Package
By: Rao Tummala
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED470
Binding:
Digital (delivered electronically)
Release:
22 Jul 2007
Language:
English
Out of Stock
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8.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao Tummala
Publisher: McGraw-Hill Education
No Review Yet
AED604
Binding:
Digital (delivered electronically)
Release:
29 May 2001
Language:
English
Out of Stock
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9.
Second-Level Microelectronics Packaging
Second-Level Microelectronics Packaging
By: Rao Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED170
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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10.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao Tummala
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED51
Binding:
Digital (delivered electronically)
Release:
29 May 2001
Language:
English
Out of Stock
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11.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao R Tummala
Publisher: McGraw-Hill Companies
No Review Yet
AED429
Binding:
Digital (delivered electronically)
Release:
01 Jan 2000
Out of Stock
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12.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED337
Binding:
Hardback
Release:
15 Sep 1996
Language:
English
Out of Stock
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