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R. R. Tummala

R. R. Tummala

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1.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
By: Tummala, Rao R.
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AED91
Binding:
Paperback
Language:
English
Available
Ships within 2-4 Days Explain..
2.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,523
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 18-20 Days Explain..
3.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
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AED924
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Sources and Expressions of Resiliency in Trauma Survivors
Sources and Expressions of Resiliency in Trauma Survivors
By: Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Inc
No Review Yet
AED177
Binding:
Paperback
Release:
15 Mar 2007
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED924
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED195
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 10-12 Days Explain..
7.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED693
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
8.
Electronic Packaging for High Reliability, Low Cost Electronics
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala
Publisher: Springer
No Review Yet
AED693
Binding:
Paperback
Release:
03 Dec 2010
Language:
English
Available
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9.
Electronic Packaging for High Reliability, Low Cost Electronics
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala
Publisher: Kluwer Academic Publishers
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AED693
Binding:
Hardback
Release:
29 Feb 2000
Language:
English
Available
Ships within 14-16 Days Explain..
10.
Sources and Expressions of Resiliency in Trauma Survivors
Sources and Expressions of Resiliency in Trauma Survivors
By: Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Ltd
No Review Yet
AED249
Release:
02 Feb 2026
Out of Stock
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11.
Sources and Expressions of Resiliency in Trauma Survivors
Sources and Expressions of Resiliency in Trauma Survivors
By: Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Ltd
No Review Yet
AED249
Release:
02 Feb 2026
Out of Stock
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12.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer My Copy UK
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AED96
Binding:
Paperback
Release:
31 Jan 1997
Out of Stock
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13.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
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AED337
Binding:
Hardback
Release:
/01/1996
Language:
English
Out of Stock
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14.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski
Publisher: Kluwer Academic Publishers Group
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AED337
Binding:
Hardback
Release:
/12/1988
Language:
English
Out of Stock
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15.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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AED114
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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16.
Microelectronics Packaging Fundamentals
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein
Publisher: Chapman and Hall
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AED257
Binding:
Hardback
Release:
/03/1998
Language:
English
Out of Stock
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17.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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AED152
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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18.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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AED189
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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19.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED361
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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20.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao R Tummala
Publisher: McGraw-Hill Companies
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AED429
Binding:
Digital (delivered electronically)
Release:
01 Jan 2000
Out of Stock
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