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Alan G. Klopfenstein

Alan G. Klopfenstein

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1.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,523
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 18-20 Days Explain..
2.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED924
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED924
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED693
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
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5.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED195
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 10-12 Days Explain..
6.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer My Copy UK
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AED96
Binding:
Paperback
Release:
31 Jan 1997
Out of Stock
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7.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
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AED337
Binding:
Hardback
Release:
15 Sep 1996
Language:
English
Out of Stock
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8.
Microelectronics Packaging Handbook, 3-part set
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,160
Binding:
Book
Release:
31 Jan 1997
Language:
English
Out of Stock
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9.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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AED114
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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10.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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AED152
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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11.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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AED189
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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12.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED361
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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13.
Second-Level Microelectronics Packaging
Second-Level Microelectronics Packaging
By: Rao Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: International Thomson Publishing Services
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AED170
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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