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Eugene J Rymaszewski

Eugene J Rymaszewski

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1.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED897
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED217
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED673
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED897
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics
By: Jain Pushkar, Eugene J. Rymaszewski
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED449
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics
By: Jain Pushkar, Eugene J. Rymaszewski
Publisher: Kluwer Academic Publishers
No Review Yet
AED449
Binding:
Hardback
Release:
30 Nov 2003
Language:
English
Available
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7.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer My Copy UK
No Review Yet
AED88
Binding:
Paperback
Release:
31 Jan 1997
Out of Stock
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8.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,569
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Out of Stock
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9.
Second-Level Microelectronics Packaging
Second-Level Microelectronics Packaging
By: Rao Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED156
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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10.
Microelectronics Packaging Handbook, 3-part set
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
AED1,067
Binding:
SA
Release:
31 Jan 1997
Language:
English
Out of Stock
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11.
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics
By: Jain Pushkar, Eugene J Rymaszewski
Publisher: Springer
4.9 (8)
AED88
Binding:
Paperback
Release:
01 Mar 2011
Out of Stock
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12.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED139
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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13.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED174
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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14.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED332
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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15.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
AED105
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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