Ultra Clean Processing of Semiconductor Surfaces VIII: (Volume 134 Solid State Phenomena)

This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.Included are studies of the surface chemistry of silicon and related semiconductors, such as SiGe and Ge, cleaning related to new gate stacks, cleaning at the interconnect level, resist strip and polymer removal, cleaning and contamination control for various new materials, wafer backside cleaning and cleaning after chemical-mechanical-polishing (CMP).The collection is divided into the chapters: SiO2 removal and drying; Surface chemistry of Si and Ge; FEOL selective wet etching and corrosion; FEOL photo-resist removal and substrate loss; Particles: removal and damage; Contamination control; Metrology; Post-CMP cleaning; and, BEOL and Contact cleaning.

Table of Contents:
Acknowledgements SiO2 removal and drying Etching of Silicon Dioxide with Gas Phase HF and Water: Initiation, Bulk Etching, and Termination. Evaluation of the Plasmaless Gaseous Etching Process Single Wafer Hydrophobic Surface Preparation on 300mm by HF Vapor Insights into HF-Last Processes and Particle Performance in a Single Wafer Spin Cleaning Tool Implementing an In Situ Surface Preparation Prior to Ni Deposition for Ni Salicide Processes Electrical Impact of Various Arsenic-Residues Cleanings Elimination of Watermark on Extremely High-Doped Poly-Silicon Surfaces Using HF-Vapor Cleaning Surface chemistry of Si and Ge Passivation Studies of Germanium Surfaces Germanium Surface Passivation Using Ozone Gaseous Phase Surface States and Recombination Loss on Wet-Chemically Passivated Si Studied by Surface Photovoltage (SPV) and Photoluminescence (PL) Surface Microroughness of Silicon in Wet Process and its Minimization Oxidation of Si Surface Utilizing SCCO2 Single-Wafer Wet Chemical Oxide Formation for Pre-ALD High-k Deposition on 300 mm Wafer Effect of SC-1 Treatment in Thermal Wall Oxide on Nanoscale STI Gap-Filling by O3/TEOS CVD FEOL selective wet etching and corrosion Etch Rate Profile Characterization of High-κ Materials Critical Thickness Threshold in HfO2 Layers Surface Preparation Challenge on Nitrided Gate Oxides Development of a New TaN Etchant for Metal Gate Peracetic Acid as Active Species in Mixtures for Selective Etching of SiGe/Si Layer Systems – Aspects of Chemistry and Analytics A Wet Etching Technique to Reveal Threading Dislocations in Thin Germanium Layers Galvanic Corrosion of Stacked Metal Gate Electrodes during Cleaning in HF Solutions The Dynamic Aspects of Electrochemical Reaction Cells in Selectively Inducing Defects on Silicon Surface FEOL photo resist removal and substrate loss Wafer Cleaning Using Supercritical CO2 in Semiconductor and Nanoelectronic Device Fabrication All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid All Wet Stripping of Implanted Photoresist Study of a Metal Gate and Silicon Selective “Dry Ash Only” Process for Combined Extension and Halo Implanted Photo Resist High Dose Implant Stripping and Residue Removal with Sequential Plasma and Vacuum Aerosol Processes Confined Chemical Cleaning: A Novel Concept Evaluated for Front End of Line Applications Impact of RF Oxygen Plasma on Thermal Oxide Etch-Rate I: Ultra-Shallow Junction Cleaning: Metrology for Evaluating Dopant Loss and Substrate Erosion II: Ultra-Shallow Junction Cleaning: Methodologies for Process and Chemistry Optimization Effect of Dopants on the Dissolution Behavior of Silicon Substrates in HF-Based Cleaning Solutions The Effect of Various Process Induced Damages on Wet Etching Rate Difference Particles: removal and damage How Bubbles (Can) Clean Aging Phenomena in the Removal of Nano-Particles from Si Wafers Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP Particle-Substrate Interaction Forces in a Non-Polar Liquid Interaction Forces between Oxide and Silica-Modified Terpolymer Abrasive and their Impact on CMP and Post-CMP Particle Deposition and Removal from Ge Wafers A Study of a Single-Wafer Process in Metal Contact Hole Cleaning The Active Role of Etch Products in Particle Removal by SC-1 Solutions New FEOL Cleaning Technology for Advanced Devices beyond 45 nm Node In Situ Particle Removal Studies Using an Optical Particle Counter Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic Modeling of Shock Wave Emission during Acoustically-Driven Cavitation-Induced Cleaning Processes Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes New Brush Scrubbing Techniques for a Wafer Bevel, Apex and Edge Low Si Recess on Cleaning Process by Dilute HF/SC-1 with Megasonic Preparation, Characterization, and Damage-Free Processing of Advanced Multiple-Gate FETs Impact of Re-Gasified Water on Megasonic Cleaning The Removal of Silica Particles from Micron Wide Trenches by Megasonic Cleaning Is there Gas Entrapped on Submerged Silicon Wafers? Visualizing Nano-Scale Bubbles with Cavitation Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal Study of the Dynamics of Local Particle Removal Efficiencies Using Localized Haze Maps Effect of Ozone Supply Methods on PRE in Alkaline Ozone Solutions Contamination control Challenges of Single-Wafer Wet Cleaning for Low Temperature Pre-Epitaxial Treatment of SiGe Estimation of Detrimental Impact of New Metal Candidates in Advanced Microelectronics Plastic Containers Contamination by Volatile Acids : Accumulation, Release and Transfer to Cu-Surfaces during Wafers Storage A Study on Germanium as a Contaminant Source in Semiconductor Fabrication Process Implementation of a System for Metal Contamination Control Based on Classification Criteria Study of Static Electricity in Wafer Cleaning Process Metrology Mapping of Metallic Contamination Using TXRF Investigation of Metallic Contamination Analysis Using Vapor Phase Decomposition – Droplet Collection – Total Reflection X-Ray Fluorescence (VPD-DC-TXRF) for Pt-Group Elements on Silicon Wafers X-Ray Spectrometry for Wafer Contamination Analysis and Speciation as Well as for Reference-Free Nanolayer Characterization Advanced Metrologies for Cleans Characterization: ARXPS, GIXF and NEXAFS Advanced TXRF Analysis: Background Reduction when Measuring High-k Materials and Mapping Metallic Contamination Novel Full Wafer Inspection Technology for Non-Visual Residue Defects Post CMP cleaning A Study on Water-Mark Defects in Copper/Low-k Chemical Mechanical Polishing Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP The Dependence of Chemical Mechanical Polishing Residue Removal on Post-Cleaning Treatments A Novel Surface Cleaning for Copper Interconnection Using Ammonium Decomposed Species Generated by Hot Wire BEOL and Contact cleanning Improvement of Contact Clean Using Single-Wafer Clean Process for 90nm and Beyond Effects of Bias, Pressure and Temperature in Plasma Damage of Ultra Low-k Films Impact of Plasma and Diluted HF on a CoWP Material Photoresist Characterization and Wet Strip after Low-k Dry Etch Implications of the Selectiveness of Cu Chelators on Cu0, Cu(I)O and Cu(II)O Powders Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution Marangoni Dryer Integrated High Performance Cleaner for Cu/Low k Post Strip Clean for 45nm Technology Node and Beyond Effect of Pressure Pulsation on Post-Etch Photoresist Stripping on Low-k Films in Supercritical CO2 Optimization of a SC CO2 Post-Etch Cleaning for Copper Interconnections Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect Effect of Wafer Rotation on Photoresist Stripping in Supercritical CO2 Metal Hard Mask Employed Cu/Low k Film Post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow Mechanism and Principles of Post Etch Al Cleaning with Inorganic Acids AlCu Metal Line Corrosion: A Case Study Copper Surface Analysis with ToF-SIMS: Spectra Interpretation and Stability Issues Influence of the Process Conditions of a Polishing Rinse after CuCMP Wet Process Developments for Electrical Properties Improvement Of 3D MIM Capacitors