Ultra Clean Processing of Silicon Surfaces VII: (Volumes 103-104 Solid State Phenomena)

This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation. Various papers deal authoritatively with FEOL applications such as surface preparation for the deposition of a gate dielectric having a high dielectric constant, as well as rinsing and drying techniques. Elsewhere, the approaching major challenge of removing nano-sized particles, without causing significant substrate removal, is addressed in detail. As well as megasonic agitation, other possible particle removal techniques are also considered. The topic of metrology is addressed, because the state-of-the-art of cleaning can only progress in step with advances in metrology. The unprecedented numbers of new materials that are currently investigated, and soon introduced into pilot and manufacturing lines, are well covered in contributions on contamination control. Contributions on post-CMP cleaning and photo-resist stripping are also included. Finally, the challenge of cleaning low-k materials following etching is addressed by a large number of papers. Altogether, this collection of papers represents a timely and authoritative assessment of the state-of-the-art of this often-overlooked, but very interesting and essential, field.

Table of Contents:
High-k Gate Dielectrics on Silicon and Germanium: Impact of Surface Preparation UV Activated Surface Preparation of Silicon for High-k Dielectric Deposition Enhanced Surface Preparation Techniques for the Si/High-k Interface Uniform Ultrathin Oxide Growth for High-k Preclean On the Application of a Thin Ozone Based Wet Chemical Oxide as an Interface for ALD High-k Deposition Interface State Densities and Surface Charge on Wet-Chemically Prepared Si(100) Surfaces A Study of the Influence of Typical Wet Chemical Treatments on the Germanium Wafer Surface Surface Preparation Techniques for High-k Deposition on Ge Substrates Advanced Surface Cleaning Strategy for 65nm CMOS Device Performance Enhancement Process, Environmental & Economical Considerations to Implement Single Wafer Cleaning Tools in 300mm Wafer Fabs In Situ Wafer Processing for Next Generation Devices Organic Contamination Control in Silicon Surface Processing Application of UV/VIS-Spectroscopy for Determination of Complexing Agent Stability in APM and Like Mixtures Thereof Plasma Cleaning for W Polymetal Gate Development of New Batch-Type Plasma Assisted NOR (Native-Oxide-Removal) Dry Cleaning Equipment Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication Surfactionated Rinse against Pattern Collapse and Defectivity in 193nm Lithography Performance of a Linear Single Wafer IPA Vapour Based Drying System Effective Rinse Aiming at Water-Mark-Free Drying for Single-Spin Wet Cleaning Process Insights into Watermark Formation and Control Occurrence of Arsenic-Based Defects and Techniques for Their Elimination Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks HF Based Solutions for HfO2 Removal; Effect of pH and Temperature on HfO2: SiO2 Etch Selectivity Selective Si3N4 Etch in Single Wafer Application Etch Rate Depth Profiling by Single Wafer Etching Equipment Novel Chemical Etching to Correct Film Thickness Distributions Etching of Silicon Oxide Films in Supercritical Carbon Dioxide Challenges of Finer Particle Detection on Bulk-Silicon and SOI Wafers The Impact of Backside Particles on the Limits of Optical Lithography Inspection Challenges at the 45nm Technology Node Metrology and Removal of Nanoparticles from 500 Micron Deep Trenches Evaluation of Megasonic Cleaning for Sub-90nm Technologies Strength Distribution of Megasonic Damage Events Using Megasonics for Particle and Residue Removal in Single Wafer Cleaning Behaviour of a Well-Designed Megasonic Cleaning System Megasonics: A Cavitation Driven Process Electrophoretic Studies on Silicon Nitride: Traces of Silicates in UPW Shift Zeta Potential Similar to SC-1 Damage-Free Cleaning of Sub-50 nm Devices Using Directed Megasonics Technology in a Single Wafer Processor A Comparison of Particle Filtration in a Recirculated Wet Bench Wet Cleaning Tool: Performance of PTFE Filters and of Surface Optimized Filters Influences of Oxide Loss on Contamination Removal Non-Damaging Particle Removal Using Cryogenic Aerosols Laser Cleaning of Particles from Silicon Wafers: Capabilities and Mechanisms Contaminants Removal from Epi Substrates Using Vapor-Laser Process Chemical Additive Formulations for Particle Removal in SCCO2-Based Cleaning Non-Damaging CO2 Aerosol Cleaning in FEOL IC Manufacturing Particle Adhesion on Tool Kit Part: Case Study for Ceramic Material Simultaneous Analysis of Light and Heavy Organic Contamination on Silicon Wafer VPD-DC-TXRF for Metallic Contamination Analysis of Ge Wafers Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis Application of HPLC for the Analysis of Organic Additives in Cleaning Chemicals and Cleaning Mixtures Chromium Contamination in Silicon: Detection and Impact on Oxide Performances Further Reduction of Trace Level Ion from Ultra Pure Water and Its Effect on Electrical Property of Device Prevention of Copper Cross-Contamination on Cu Process and Non-Cu Process Mixed Fabrication Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing Direct Mixing Cleaning Method of Aqua Regia on Wafer Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide The Degradation Prevention of Resin Materials for Semiconductor Manufacturing Equipment by Applying the Ultra-High Purity Gas Supply Technology Measurement and Control of Airborne Molecular Contamination during Wafer Storage and Transport Purification of Trace Amount of Metal Impurity from Ultra Pure Water Using Membrane Purifier/Filter Metal Contamination on Silicon Surfaces from Solvents Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP A Force Study in Brush Scrubbing Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning Investigation of Dissolution and Electrodeposition of Copper in Concentrated and Diluted Oxalic Acid Media in Post-CMP Cleaning Non-Contact Cleaning Process for Post-CMP Copper Novel Photo Resist Stripping for Single Wafer Process Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives Cleaning Capability of High Concentration Ozonated Water Photoresist Stripping by Ozone/Water Processes: Effect of Additives Supercritical CO2 Applications in BEOL Cleaning Repair of Porous MSQ (p-MSQ) Films Using Monochlorosilanes Dissolved in Supercritical CO2 Copper Decontamination Ability of Supercritical-CO2/Additives on CVD and Spin-On Porous MSQ Materials Angled XPS Analysis of Low-k Dielectric Surfaces after Cleaning Impact of Downstream Ash Plasmas on Ultra Low-k Materials Activated He:H2 Strip of Photoresist over Porous Low-k Materials Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect Effect of Chemical Solution on the Stability of Low-k Films Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow Via Cleaning Technology for Post Etch Residues Barrier and Copper Seedlayer Wet Etching Deposition Behavior of Volatile Acidic Contaminants on Metallic Interconnect Surfaces Effects of Patterns on Corrosion in Cu CMP Advanced Aqueous Cleaner II: PER Removal from Sensitive Cu/Low-k Devices Advanced Aqueous Cleaner I, Dilute Solutions for the Selective Removal of Post Etch Residues in the Presence of Aluminium New Post Etch Polymer Removal Process for Al-Interconnects and Vias in Tank and Spray Tools Using a New Inorganic Chemistry Effective Polymer Removal: Process Window-Process Uniformity-Extended Chemical Bath-Life