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1.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
By: Tummala, Rao R.
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AED88
Binding:
Paperback
Language:
English
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2.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao R Tummala
Publisher: McGraw-Hill Companies
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AED470
Binding:
Digital (delivered electronically)
Release:
01 Jan 2000
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3.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
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AED369
Binding:
Hardback
Release:
15 Sep 1996
Language:
English
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