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S. W. Ricky Lee

S. W. Ricky Lee

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1.
From LED to Solid State Lighting
From LED to Solid State Lighting
By: S. W. Ricky Lee, Jeffery C. C. Lo, Huaiyu Ye, Mian Tao
Publisher: John Wiley & Sons Inc
No Review Yet
AED567
Binding:
Hardback
Release:
18 Oct 2021
Language:
English
International Edition
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2.
From LED to Solid State Lighting
From LED to Solid State Lighting
By: S. W. Ricky Lee, Jeffery C. C. Lo, Huaiyu Ye, Mian Tao
Publisher: John Wiley & Sons Inc
No Review Yet
AED42
Binding:
Digital (delivered electronically)
Release:
09 Sep 2021
Language:
English
Out of Stock
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3.
From LED to Solid State Lighting
From LED to Solid State Lighting
By: S. W. Ricky Lee, Jeffery C. C. Lo, Huaiyu Ye, Mian Tao
Publisher: John Wiley & Sons Inc
No Review Yet
AED144
Binding:
Digital (delivered electronically)
Release:
17 Sep 2021
Language:
English
Out of Stock
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4.
From LED to Solid State Lighting – Principles, Materials, Packaging, Characterization, and Applications
From LED to Solid State Lighting – Principles, Materials, Packaging, Characterization, and Applications
By: S. W. Ricky Lee, Jeffery C. C. Lo, Huaiyu Ye, Mian Tao
Publisher: John Wiley & Sons Inc
No Review Yet
AED612
Binding:
Other digital
Release:
17 Sep 2021
Language:
English
Out of Stock
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5.
CHIP SCALE PACKAGE, CSP
CHIP SCALE PACKAGE, CSP
By: Ricky S.W. Lee, John H. Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED277
Binding:
Hardback
Release:
28 Feb 1999
Language:
English
Out of Stock
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6.
Electronics Manufacturing
Electronics Manufacturing
By: Ning-Cheng Lee, John H Lau, C P Wong, Ricky S W Lee
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED88
Binding:
Digital (delivered electronically)
Release:
13 Sep 2002
Language:
English
Out of Stock
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7.
Electronics Manufacturing
Electronics Manufacturing
By: Ning-Cheng Lee, John H Lau, C P Wong, Ricky S W Lee
Publisher: McGraw-Hill Companies
No Review Yet
AED661
Binding:
Digital (delivered electronically)
Release:
13 Sep 2002
Language:
English
Out of Stock
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8.
Microvias: For Low Cost, High Density Interconnects
Microvias: For Low Cost, High Density Interconnects
By: John H Lau, Ricky S W Lee
Publisher: McGraw-Hill Professional Publishing
No Review Yet
AED409
Binding:
Digital (delivered electronically)
Release:
26 Apr 2001
Language:
English
Out of Stock
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9.
Chip Scale Package, CSP
Chip Scale Package, CSP
By: John H Lau, Ricky S W Lee
Publisher: McGraw-Hill Education
No Review Yet
AED367
Binding:
Digital (delivered electronically)
Release:
21 Mar 1999
Language:
English
Out of Stock
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10.
Microvias: For Low Cost, High Density Interconnects
Microvias: For Low Cost, High Density Interconnects
By: John H Lau, Ricky S W Lee
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED369
Binding:
Digital (delivered electronically)
Release:
21 May 2001
Language:
English
Out of Stock
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