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1.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED394
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED809
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Electronics Manufacturing
Electronics Manufacturing
By: Ning-Cheng Lee, John H Lau, C P Wong, Ricky S W Lee
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED88
Binding:
Digital (delivered electronically)
Release:
13 Sep 2002
Language:
English
Out of Stock
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4.
Electronics Manufacturing
Electronics Manufacturing
By: Ning-Cheng Lee, John H Lau, C P Wong, Ricky S W Lee
Publisher: McGraw-Hill Companies
No Review Yet
AED661
Binding:
Digital (delivered electronically)
Release:
13 Sep 2002
Language:
English
Out of Stock
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5.
Reflow Soldering Processes
Reflow Soldering Processes
By: Ning-Cheng Lee
Publisher: Newnes
No Review Yet
AED617
Binding:
Digital (delivered electronically)
Release:
01 Jan 2002
Out of Stock
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6.
Reflow Soldering Processes
Reflow Soldering Processes
By: Ning-Cheng Lee
Publisher: Newnes
No Review Yet
AED101
Binding:
Digital (delivered electronically)
Release:
14 May 2014
Language:
English
Out of Stock
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