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C P Wong

C P WongC. P. Wong is a Regents' Professor (the highest ranking distinguished Professor at Georgia Tech) at the School of Materials Science and Engineering and a Research Director at the NSF Packaging Research Center at Georgia Institute of Technology. He reeived his B.S. degree in chemistry from Purdue University, and his Ph.D. degree in chemistry from Pennsylvania State University. Thereafter, he was awarded a two-year Postdoctoral Fellowship at Stanford University with Nobel Laureate Prof. Henry Taube. Dr. Wong spent 19 years at AT&T Bell Labs and was elected as a Bell Labs Fellow(the most prestigious Award bestowed by AT&T Bell Labs) in 1992. His research interests lie in the fields of polymeric materials, reaction mechanism, IC encapsulation, in particular, hermetic equivalent plastic packaging, electronic packaging processes, interfacial adhesions, PWB, SMT assembly and component reliability. He received many awards, among those, the AT&T Bell Laboratories Distinguished Technical Staff Award in 1987, the AT&T Bell Labs Fellow Award in 1992, the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Outstanding and Best Paper Awards in 1990, 1991, 1994, 1996 and 1998, the IEEE Technical Activities Board Distinguished Award in 1994, the 1995 IEEE CPMT Society's Outstanding Sustained Technical Contribution Award, the 1999 Georgia Tech's Outstanding Faculty Research Program Development Award, the 1999 NSF-Packaging Research Center Faculty of the Year Award, the Georgia Tech Sigma Xi Faculty Best Research Paper Award in 2000 and the University Press (London, UK) Award of Excellence in 2000. He holds over 45 U.S. patents, numerous international patents, and over 270 technical papers in the related area. For the past five years since joining Georgia Tech, he has been a Research Director at the world renowned NSF electronic Packaging Center. Leading a team of 32 faculty from six departments and 270 graduate students from Georgia Tech. Besides, he also works with over sixty United States, Japan, and European major semiconductor companies providing a leadership role in technology transfer. Dr. Wong was elected a member of the National Academy of Engineering in 2000, and he is a Fellow of the IEEE, AIC and AT&T Bell Labs, and was the general chairman of the IEEE/EIA 41st Electronic Components and Technology Conference in 1991. He served as the technical vice president (1990 & 1991), and the president (1992 & 1993) of the IEEE-CPMT Society, member of the IEEE TAB management committee in 1993-94, chair of the IEEE TAB Design and Manufacturing Engineering in 1995-97 and the IEEE Nomination and Appointment committee in 1996-97. Read More Read Less

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One Team, One Fight
Publisher: RAND Corporation
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AED125
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25 Jul 2025
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Nano-Bio- Electronic, Photonic and MEMS Packaging
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AED787
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19 Mar 2022
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Nano-Bio- Electronic, Photonic and MEMS Packaging
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AED1,232
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18 Mar 2021
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Electrical Conductive Adhesives with Nanotechnologies
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AED860
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05 Sep 2014
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Materials for Advanced Packaging
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AED1,113
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08 Jun 2018
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Materials for Advanced Packaging
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AED910
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10 Dec 2008
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Electrical Conductive Adhesives with Nanotechnologies
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AED860
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16 Oct 2009
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Materials for Advanced Packaging
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AED1,517
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30 Dec 2016
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The Positive Psychology of Meaning and Spirituality
Publisher: Purpose Research
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AED182
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18 Jul 2012
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Handbook of Multicultural Perspectives on Stress and Coping
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AED626
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15 Dec 2005
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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Decision Making in Health and Medicine
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Advanced Flip Chip Packaging
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AED1,011
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21 Mar 2013
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Advanced Flip Chip Packaging
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AED756
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23 Aug 2016
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Nano-Bio- Electronic, Photonic and MEMS Packaging
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AED1,182
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01 Sep 2014
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Nano-Bio- Electronic, Photonic and MEMS Packaging
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AED632
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01 Dec 2009
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Efficiency in Natural Product Total Synthesis
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AED479
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30 Nov 2018
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