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John H Lau

John H LauJohn H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world. Ricky S. Lee (Hong Kong, China) is a Professor of Electrical Engineering at the Univerity of Hong Kong. Read More Read Less

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1.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
AED236
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
Ships within 10-12 Days Explain..
2.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED318
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
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3.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED366
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED701
Binding:
Hardback
Release:
18 May 2021
Language:
English
International Edition
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5.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED739
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Heterogeneous Integrations
Heterogeneous Integrations
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED739
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
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7.
Solder Joint Reliability
Solder Joint Reliability
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED924
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
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8.
Chip On Board
Chip On Board
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED924
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
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9.
Handbook Of Tape Automated Bonding
Handbook Of Tape Automated Bonding
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED924
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
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10.
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED693
Binding:
Hardback
Release:
13 Apr 2018
Language:
English
Available
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11.
Solder Joint Reliability
Solder Joint Reliability
By: John H. Lau
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED924
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
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12.
Mechanics of Solder Alloy Interconnects
Mechanics of Solder Alloy Interconnects
By: Darrel R. Frear, John H. Lau, Harold S. Morgan, Steven N. Burchett
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED924
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
Available
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13.
Heterogeneous Integrations
Heterogeneous Integrations
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
AED241
Binding:
Paperback
Release:
06 Apr 2019
Language:
English
Out of Stock
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14.
Microvias
Microvias
By: John H Lau, Ricky S Lee
Publisher: McGraw-Hill Companies
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AED59
Binding:
Digital (delivered electronically)
Release:
01 Jan 2001
Out of Stock
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15.
Heterogeneous Integrations
Heterogeneous Integrations
By: John H Lau
Publisher: Springer
No Review Yet
AED448
Binding:
Paperback
Release:
04 Jun 2019
Language:
English
Out of Stock
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16.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED555
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Out of Stock
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17.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED96
Binding:
Hardback
Release:
24 May 2024
Language:
English
Out of Stock
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18.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED71
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Out of Stock
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