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John H Lau

John H LauJohn H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world. Ricky S. Lee (Hong Kong, China) is a Professor of Electrical Engineering at the Univerity of Hong Kong. Read More Read Less

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1.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
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AED348
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
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2.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED394
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
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3.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED757
Binding:
Hardback
Release:
18 May 2021
Language:
English
International Edition
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4.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED809
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
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5.
Heterogeneous Integrations
Heterogeneous Integrations
By: John H. Lau
Publisher: Springer Verlag, Singapore
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AED809
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
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6.
Solder Joint Reliability
Solder Joint Reliability
By: John H. Lau
Publisher: Springer-Verlag New York Inc.
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AED1,011
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
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7.
Solder Joint Reliability
Solder Joint Reliability
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED1,011
Binding:
Hardback
Release:
31 May 1991
Language:
English
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8.
Handbook Of Tape Automated Bonding
Handbook Of Tape Automated Bonding
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED1,011
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
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9.
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
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AED759
Binding:
Hardback
Release:
13 Apr 2018
Language:
English
Available
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10.
Chip On Board
Chip On Board
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED1,011
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
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11.
Mechanics of Solder Alloy Interconnects
Mechanics of Solder Alloy Interconnects
By: Darrel R. Frear, John H. Lau, Harold S. Morgan, Steven N. Burchett
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED1,011
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
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12.
Heterogeneous Integrations
Heterogeneous Integrations
By: John H Lau
Publisher: Springer
No Review Yet
AED490
Binding:
Paperback
Release:
04 Jun 2019
Language:
English
Out of Stock
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13.
Microvias
Microvias
By: John H Lau, Ricky S Lee
Publisher: McGraw-Hill Companies
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AED64
Binding:
Digital (delivered electronically)
Release:
01 Jan 2001
Out of Stock
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14.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED607
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Out of Stock
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15.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED105
Binding:
Hardback
Release:
24 May 2024
Language:
English
Out of Stock
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16.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED78
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Out of Stock
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17.
Building Leadership Bridges Book Set (2015-2019)
Building Leadership Bridges Book Set (2015-2019)
By: Matthew Sowcik, Jean Lau Chin, Seana Lowe Steffen, H. Eric Schockman, John Eric Baugher
Publisher: Emerald Publishing Limited
No Review Yet
AED895
Binding:
SA
Release:
10 Aug 2020
Language:
English
Out of Stock
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18.
Through-Silicon Vias for 3D Integration
Through-Silicon Vias for 3D Integration
By: John H Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED595
Binding:
Digital (delivered electronically)
Release:
05 Aug 2012
Language:
English
Out of Stock
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