1.

Towards a Trinitarian Theology of Religions

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AED221

Binding:	Paperback
Release:	01 Jan 1994
Language:	English

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Advanced Flip Chip Packaging

By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong

Publisher: Springer-Verlag New York Inc.

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AED671

Binding:	Paperback
Release:	23 Aug 2016
Language:	English

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Advanced Flip Chip Packaging

By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong

Publisher: Springer-Verlag New York Inc.

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AED897

Binding:	Hardback
Release:	21 Mar 2013
Language:	English

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4.

AI Technology Management and Value Creation

By: P.C. Lai

Publisher: IGI Global

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AED514

Binding:	Paperback
Release:	07 Nov 2025
Language:	English

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Technology Management and Its Social Impact on Education

By: P.C. Lai

Publisher: IGI Global

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AED135

Binding:	Paperback
Release:	18 Aug 2023
Language:	English

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Strategies and Opportunities for Technology in the Metaverse World

By: P.C. Lai

Publisher: IGI Global

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AED923

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Release:	06 Jan 2023
Language:	English

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Strategies and Opportunities for Technology in the Metaverse World

By: P.C. Lai

Publisher: IGI Global

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AED923

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Release:	06 Jan 2023
Language:	English

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Technology Management and Its Social Impact on Education

By: P.C. Lai

Publisher: IGI Global

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AED735

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Release:	18 Aug 2023
Language:	English

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9.

Technology Management and Its Social Impact on Education

By: P.C. Lai

Publisher: IGI Global

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AED108

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Release:	18 Aug 2023
Language:	English

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Technology Management and Its Social Impact on Education

By: P.C. Lai

Publisher: IGI Global

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AED889

Binding:	SA
Release:	18 Aug 2023
Language:	English

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11.

Handbook of Research on Social Impacts of E-Payment and Blockchain Technology

By: P.C. Lai

Publisher: IGI Global

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AED1,484

Binding:	Digital download and online
Release:	10 Dec 2021
Language:	English

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Handbook of Research on Social Impacts of E-Payment and Blockchain Technology

By: P.C. Lai

Publisher: IGI Global

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AED1,791

Binding:	SA
Release:	10 Dec 2021
Language:	English

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Handbook of Research on Social Impacts of E-Payment and Blockchain Technology

By: P.C. Lai

Publisher: IGI Global

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AED1,484

Binding:	Digital download and online
Release:	10 Dec 2021
Language:	English

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14.

Advanced Flip Chip Packaging

By: Yi-Shao Lai, C P Wong, Ho-Ming Tong (Thomas J. Watson Research Center, Yorktown Heights, New York)

Publisher: Springer

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AED28

Binding:	Paperback
Release:	30 Apr 2013

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15.

Challenges for the 21st Century

By: K K Phua, C H Lai, C H Oh, E -C Tan, J P Jesudason

Publisher: World Scientific Publishing Company

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AED801

Binding:	Digital (delivered electronically)
Release:	01 Jan 2001

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