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Advanced Flip Chip Packaging

By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong

Publisher: Springer-Verlag New York Inc.

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AED969

Binding:	Hardback
Release:	21 Mar 2013
Language:	English

International Edition

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Characterization of Polymers

By: Ned J. Chou, Stephen P. Kowalczyk, Ravi Saraf, Ho-Ming Tong

Publisher: Momentum Press

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AED181

Binding:	Hardback
Release:	16 Apr 2010
Language:	English

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New Characterization Techniques for Thin Polymer Films

By: Ho-Ming Tong, Luu T. Nguyen

Publisher: John Wiley and Sons Ltd

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AED860

Binding:	Hardback
Release:	14 May 1990
Language:	English

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Advanced Flip Chip Packaging

By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong

Publisher: Springer-Verlag New York Inc.

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AED43

Binding:	Paperback
Release:	23 Aug 2016
Language:	English

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Characterization of Polymers

By: Ned J. Chou, Stephen P. Kowalczyk, Ravi Saraf, Ho-Ming Tong

Publisher: Momentum Press

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AED40

Binding:	Digital (delivered electronically)
Release:	14 May 2014
Language:	English

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Advanced Flip Chip Packaging

By: Yi-Shao Lai, C P Wong, Ho-Ming Tong (Thomas J. Watson Research Center, Yorktown Heights, New York)

Publisher: Springer

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AED32

Binding:	Paperback
Release:	30 Apr 2013

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