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Home > Science, Technology & Agriculture > Industrial chemistry and manufacturing technologies > Other manufacturing technologies > Electronic Packaging Interconnect Technology: (Volume 273 Solid State Phenomena)
Electronic Packaging Interconnect Technology: (Volume 273 Solid State Phenomena)

Electronic Packaging Interconnect Technology: (Volume 273 Solid State Phenomena)


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About the Book

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.

Table of Contents:
Preface Chapter 1: Materials and Technologies for Soldering Processes in Electronics Industry The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding Grain Refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl Solution Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification Tensile Properties of Sn-Bi Lead-Free Solder Alloys Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in NaСl Solution STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds Effect of Trace Elements on the Liquid Structure of Sn-Cu Alloys Investigated by High Energy X-Ray Diffraction Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth Chapter 2: Materials and Chemical Technologies Palladium(II) Picoline Thiourea Complex as Homogenous Catalyst in Heck Cross-Coupling Reaction in the Formation of C=C Bond Aloe Vera Liquid Crystal Emulsion and Characterization of its Physical Properties Diffractografic Analysis of AISI 420 Steel Synthesis, Characterization and Crystal Structure of Coordination Polymers Developed as Anion Receptor Synthesis and Characterization of Ag/TiO2 Thin Film via Sol-Gel Method The Effect of Temperature on Anatase TiO2 Photoanode for Dye Sensitized Solar Cell Manganese Substituted Iron Titanate Particles with Enhancement Adsorption Capacity for Removal of Remazol Brilliant Blue R Dye Evaluation of ICP-OES Method for Heavy Metal and Metalloids Determination in Sterile Dump Material The Formation and Properties of Zeolite-A and Zeolite-X through Geopolymerisation of Metakaolin Effect of Geopolymer Coating on Mild Steel Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy


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Product Details
  • ISBN-13: 9783035733242
  • Publisher: Trans Tech Publications Ltd
  • Publisher Imprint: Trans Tech Publications Ltd
  • Language: English
  • Series Title: Volume 273 Solid State Phenomena
  • ISBN-10: 3035733244
  • Publisher Date: 13 Apr 2018
  • Binding: Digital download and online
  • No of Pages: 210


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