Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam(418 Springer Proceedings in Physics)

This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.

Table of Contents:
Electronic Packaging.- Advanced Materials.- Green Materials.- Surface Coating.

About the Author :
Dr. Nurul Razliana Abdul Razak serves as Senior Lecturer under the Welding Technology Programme at the Faculty of Mechanical Engineering Technology, Universiti Malaysia Perlis. She obtained her PhD from The University of Queensland, Australia, specialising in Materials Engineering. Currently, she the member of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. She has experience working and lecturing in the electronic materials, material processing technology and advanced metallurgy and manufacturing for more than 10 years. Her research interests primarily revolve around electronics interconnect solder materials.​ Dr. Mohd Arif Anuar Mohd Salleh is an Associate Professor under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. He graduated with B.Eng honours in Mechanical Engineering (2006) followed by M.Eng in Mechanical Engineering majoring in Materials (2007) from the Universiti Tun Hussein Onn Malaysia. He received his PhD in 2016 from the University of Queensland, Australia in the field of Materials Engineering specifically in the development of advance solder materials. He is currently the President of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. He has experience working and lecturing in the electronic packaging materials field for more than 13 years. He also worked as part time research officer for a few research projects on solder materials development at the University of Queensland Australia (2013-2015) and at Imperial College London (2015). Dr. Dewi Suriyani Che Halin is a Senior Lecturer under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. She graduated with B.Eng honours in Mineral Resources Engineering (2004) and Masters in Science (M. Sc.) in Materials Engineering (2005) from Universiti Sains Malaysia. She received her PhD in 2009 from Universiti Kebangsaan Malaysia in the field of Materials Science specifically in the semiconductor materials. She is currently the member of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. She has experience working and lecturing in the surface engineering and electronic packaging materials field for more than 11 years. Dr. Kamrosni Abdul Razak is a Senior Lecturer under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. She graduated with B.Eng with honours in Mechanical Engineering (2004) from Universiti Kebangsaan Malaysia.  She received her Master in Science (M. Sc.) in Materials Engineering (2012) and PhD in 2020 from Universiti Malaysia in the field of Materials Science specifically in semiconductor materials. She is currently the member of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. She has experience working and lecturing in materials field for more than 11 years. Dr. Flora Somidin is currently a senior lecturer in the Materials Department at the Faculty of Chemical Engineering & Technology, Universiti Malaysia Perlis (UniMAP). She obtained her PhD from The University of Queensland, Australia, focusing on Materials Engineering with a specific emphasis on the advancement of solder materials. Muhammad Fadlin Hazim Baser graduated from the Universiti Sains Malaysia (USM), Pulau Pinang, Malaysia. He is currently pursuing a Doctor of Philosophy (Ph.D.) with a major in materials engineering and has previous experience as an engineer at a semiconductor company manufacturing integrated circuits (ICs). His main field of interest is research in the development of lead-free solder alloy materials for applications that require high temperatures and reliability. His research work involves advanced material characterization techniques like synchrotron XRD, synchrotron XRF, and synchrotron tomography. These methodologies have played a significant role in numerous breakthroughs within the field of solder alloy development. He had actively collaborated with the global solder manufacturer Nihon Superior Co. Ltd., based in Osaka, Japan, for the present research and development activities.