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John Lau

John LauJohn Lau is Associate Dean for the School of Design and Technology at London College of Fashion, UK. Designing Accessories (Bloomsbury Academic, 2012) was his first book.

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1.
Mindfulness for Child and Adolescent Well-Being
Mindfulness for Child and Adolescent Well-Being
By: John Chi-Kin Lee, Kevin Ka Shing Chan, Elsa Ngar Sze Lau
Publisher: Taylor & Francis Ltd
No Review Yet
AED163
Binding:
Paperback
Release:
27 Jun 2025
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
AED237
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
Ships within 10-12 Days Explain..
3.
Ultra-high Frequency Linear Fiber Optic Systems
Ultra-high Frequency Linear Fiber Optic Systems
By: John Park, Olav Solgaard, Kam Y. Lau, Kerry J. Vahala
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
AED97
Binding:
Hardback
Release:
/10/2006
Language:
English
Available
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4.
The Broth of Oblivion
The Broth of Oblivion
By: Benjamin Lee, John Lau
Publisher: Independently Published
No Review Yet
AED66
Binding:
Paperback
Release:
07 Jun 2019
Language:
English
International Edition
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5.
Basics Fashion Design 09: Designing Accessories
Basics Fashion Design 09: Designing Accessories
By: John Lau
Publisher: Bloomsbury Publishing PLC
No Review Yet
AED81
Binding:
Paperback
Release:
20 Jan 2019
Language:
English
Available
Ships within 2-4 Days Explain..
6.
Classical Chinese Literature: An Anthology of Translations
Classical Chinese Literature: An Anthology of Translations
By: Joseph S. M. Lau, John Minford
Publisher: Columbia University Press
No Review Yet
AED238
Binding:
Paperback
Release:
27 Mar 2002
Language:
English
International Edition
Ships within 14-16 Days Explain..
7.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED585
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Available
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8.
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
By: John Lau, Xuejun Fan
Publisher: Springer Nature Switzerland AG
No Review Yet
AED877
Binding:
Hardback
Release:
19 May 2025
Language:
English
Available
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9.
Nihil
Nihil
By: John Lau, Joshua Hagler
Publisher: Unicorn Publishing Group
No Review Yet
AED155
Binding:
Hardback
Release:
24 Jul 2025
Language:
English
International Edition
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10.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED828
Binding:
Hardback
Release:
24 May 2024
Language:
English
Available
Ships within 14-16 Days Explain..
11.
Mindfulness for Child and Adolescent Well-Being
Mindfulness for Child and Adolescent Well-Being
By: John Chi-Kin Lee, Kevin Ka Shing Chan, Elsa Ngar Sze Lau
Publisher: Taylor & Francis Ltd
No Review Yet
AED606
Binding:
Hardback
Release:
29 Feb 2024
Language:
English
Available
Ships within 14-16 Days Explain..
12.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED828
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
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13.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED318
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
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14.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED560
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
Ships within 14-16 Days Explain..
15.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
AED780
Binding:
Hardback
Release:
18 May 2021
Language:
English
Available
Ships within 14-16 Days Explain..
16.
Representing Agency in Popular Culture
Representing Agency in Popular Culture
By: Mary L. Fahrenbruck, Sin Wen Lau, David Buckingham, John Kerr, Michael G. Cornelius
Publisher: Bloomsbury Publishing PLC
No Review Yet
AED241
Binding:
Paperback
Release:
12 Apr 2021
Language:
English
International Edition
Ships within 10-12 Days Explain..
17.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
AED780
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 14-16 Days Explain..
18.
Media Culture in Transnational Asia
Media Culture in Transnational Asia
By: Hiroki Yamamoto, John Gagnon, Dorothy Wai Sim Lau, Alireza Dehghan, Darlene Machell Espena
Publisher: Rutgers University Press
No Review Yet
AED478
Binding:
Hardback
Release:
17 Sep 2020
Language:
English
Available
Ships within 12-14 Days Explain..
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