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Xuejun Fan

Xuejun Fan

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1.
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
By: John Lau, Xuejun Fan
Publisher: Springer Nature Switzerland AG
No Review Yet
AED910
Binding:
Hardback
Release:
19 May 2025
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Solid State Lighting Reliability Part 2
Solid State Lighting Reliability Part 2
By: Guo Qi Zhang, Willem Dirk Van Driel, Xuejun Fan
Publisher: Springer International Publishing AG
No Review Yet
AED1,113
Binding:
Paperback
Release:
02 Aug 2018
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Solid State Lighting Reliability Part 2
Solid State Lighting Reliability Part 2
By: Guo Qi Zhang, Willem Dirk Van Driel, Xuejun Fan
Publisher: Springer International Publishing AG
No Review Yet
AED1,113
Binding:
Hardback
Release:
20 Jul 2017
Language:
English
Available
Ships within 14-16 Days Explain..
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