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C. P Wong

C. P Wong

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1.
Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
By: Kyoung-Sik (Jack) Moon, Yi Li, C. P.(Ching-Ping) Wong
Publisher: Springer Nature Switzerland AG
No Review Yet
AED813
Binding:
Paperback
Release:
19 Mar 2022
Language:
English
International Edition
Ships within 18-20 Days Explain..
2.
Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
By: Kyoung-Sik (Jack) Moon, Yi Li, C. P.(Ching-Ping) Wong
Publisher: Springer Nature Switzerland AG
No Review Yet
AED836
Binding:
Hardback
Release:
18 Mar 2021
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
By: C.P. Wong, Yi (Grace) Li, Daniel Lu
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED860
Binding:
Paperback
Release:
05 Sep 2014
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Materials for Advanced Packaging
Materials for Advanced Packaging
By: C.P. Wong, Daniel Lu
Publisher: Springer International Publishing AG
No Review Yet
AED1,113
Binding:
Paperback
Release:
08 Jun 2018
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
By: C.P. Wong, Yi (Grace) Li, Daniel Lu
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED860
Binding:
Hardback
Release:
16 Oct 2009
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Materials for Advanced Packaging
Materials for Advanced Packaging
By: C.P. Wong, Daniel Lu
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED910
Binding:
Hardback
Release:
10 Dec 2008
Language:
English
Available
Ships within 14-16 Days Explain..
7.
Materials for Advanced Packaging
Materials for Advanced Packaging
By: C.P. Wong, Daniel Lu
Publisher: Springer International Publishing AG
No Review Yet
AED1,517
Binding:
Hardback
Release:
30 Dec 2016
Language:
English
Available
Ships within 14-16 Days Explain..
8.
Handbook of Multicultural Perspectives on Stress and Coping
Handbook of Multicultural Perspectives on Stress and Coping
By: Paul T. P. Wong, Lilian C. J. Wong, W.J. Lonner
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED670
Binding:
Hardback
Release:
15 Dec 2005
Language:
English
Available
Ships within 10-12 Days Explain..
9.
The Positive Psychology of Meaning and Spirituality
The Positive Psychology of Meaning and Spirituality
By: Lilian C J Wong, Marvin J McDonald, Paul T P Wong
Publisher: Purpose Research
No Review Yet
AED194
Binding:
Paperback
Release:
18 Jul 2012
Language:
English
International Edition
Ships within 16-18 Days Explain..
10.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED440
Binding:
Hardback
Release:
01 Oct 2006
Language:
English
Available
Ships within 10-12 Days Explain..
11.
Decision Making in Health and Medicine
Decision Making in Health and Medicine
By: Paul P. Glasziou, Joseph S. Pliskin, John B. Wong, M. G. Myriam Hunink, Milton C. Weinstein
Publisher: Cambridge University Press
No Review Yet
AED474
Binding:
Paperback
Release:
16 Oct 2014
Language:
English
Available
Ships within 10-12 Days Explain..
12.
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED756
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Available
Ships within 12-14 Days Explain..
13.
Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
By: Kyoung-Sik Moon, C.P. Wong, Yi (Grace) Li
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED1,182
Binding:
Paperback
Release:
01 Sep 2014
Language:
English
Available
Ships within 12-14 Days Explain..
14.
Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
By: Kyoung-Sik Moon, C.P. Wong, Yi (Grace) Li
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED675
Binding:
Hardback
Release:
01 Dec 2009
Language:
English
Available
Ships within 10-12 Days Explain..
15.
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED1,011
Binding:
Hardback
Release:
21 Mar 2013
Language:
English
Available
Ships within 14-16 Days Explain..
16.
Efficiency in Natural Product Total Synthesis
Efficiency in Natural Product Total Synthesis
By: Pei-Qiang Huang, Zhu-Jun Yao, Richard P. Hsung, Henry N.C. Wong
Publisher: John Wiley & Sons Inc
No Review Yet
AED490
Binding:
Hardback
Release:
30 Nov 2018
Language:
English
Available
Ships within 4-6 Days Explain..
17.
One Team, One Fight
One Team, One Fight
By: Alexander C Hou, Michael Miller , Jonathan P Wong
Publisher: RAND Corporation
No Review Yet
AED105
Binding:
Paperback
Release:
25 Jul 2025
Language:
English
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