Microelectronics Packaging Materials Database on CD-ROM
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Microelectronics Packaging Materials Database on CD-ROM

Microelectronics Packaging Materials Database on CD-ROM


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About the Book

NEW! A comprehensive and up-to-date source of evaluated properties for a wide variety of materials used for semiconductor device packaging. The "Microelectronics Packaging Materials Database" provides the semiconductor packaging engineer with a comprehensive and up-to-date source of evaluated properties for a wide variety of materials used for semiconductor device packaging. Since materials play a strong role in packaging design, manufacturability, performance, reliability and cost, this database has a major impact on cost-effective packaging technologies. Key Features: Evaluated material property values based on worldwide open literature; Sponsored by the Semiconductor Research Corporation (SRC); Proprietary experimental data obtained from analysis and evaluation performed by experts; Easy to use graphical user interface (GUI); Data provided in tabular and graphic formats; Detailed material pedigree and metadata information; Meticulously referenced data; Thousands of multipoint curves and tables providing property information for hundreds of important packaging materials; Updated annually.

Table of Contents:
Materials Covered: Leaded and Lead-Free Solders; Lead Frame Alloys; Bonding Wire Alloys; Elemental Materials; Intermetallics; Semiconductors; Ceramics and Glass-Ceramics; Neat and Filled Epoxies; Molding Compounds; Adhesives/Underfill Encapsulants; Thermal Tapes; Polymer Dielectrics; Polymer Matrix Laminates; Metal Matrix Composites; Liquids and Gases. Properties Covered: Adhesion Strength; Biaxial Stress and Strain; Bulk Modulus; Compressibility; Compressive Plastic Deformation; Compressive Strength; Contact Angle; Creep Strain; Curie Temperature; Density; Die Shear Strength; Dielectric Constant & Loss Factor; Dissipation Factor; Dynamic Shear Modulus; Dynamic Young's Modulus; Electrical Conductivity & Resistivity; Elongation; Fatigue, Bend Strain Range; Fatigue, Maximum Stress; Fatigue, Sheer Stress and Strain Range; Fatigue, Stress Amplitude; Film Stress and Strain; Flexural Modulus & Strength; Flow Stress & Time; Fracture Strength; Fracture Toughness, K(Ic); Gel Time; Glass Transition Temperature; Hardness; Heat Capacity; Interfacial Tension; Loss Modulus; Mass Diffusion Coefficient; Moisture Content; Molding Time; Normal Spectral Emissivity; Normal Total Emissivity; Oxidation Rate; Poisson's Ratio; Porosity; Pot Life; Relative Density; Relaxation Modulus; Shear Modulus; Shear Strength; Shelf Life; Stress vs. Strain in Compression; Stress vs. Strain in Shear; Strain vs. Strain in Tension; Surface Resistivity; Tensile Strain at Fracture; Tensile Strength; Thermal Conductivity, Expansion, Impedance; Thermal Stress; Viscosity; Volume Resistivity; Water Absorption & Diffusion Coefficient; Weight Loss; Young's Modulus. Properties Provided as Functions of: Acceptor Concentration; Aging Temperature; Aging Time; Alloying Element Content; Cold Work; Creep Strain Rate; Creep, Applied Stress; Cure Temperature & Time; Cycles to Failure; Degradation; Temperature; Density; Deposition Temperature; Diameter; Electric Field; Electrical Resistivity; Exposure Time; Fatigue Life & Shear Strain Range; Filler Content; Film Thickness; Firing Temperature; Frequency; Grain Size; Heating Rate; Indentation Depth; Intermetallic Content & Thickness; Lanthanum Content; Length; Length/Diameter Ratio, Fiber; Lifetime; Line Width: Load; Mold Temperature; Molding Time; Passivation Thickness; Porosity; Postcure Temperature; Relative Density; Relative Humidity; Shear Strain Rate; Sintering Temperature; Soldering Temperature; Strain Rate; Stress Ratio, R; Temperature; Thermal Cycling; Thickness; Time; Wavelength; Width.


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Product Details
  • ISBN-13: 9780815514664
  • Publisher: William Andrew Publishing
  • Publisher Imprint: Plastics Design Library
  • Height: 120 mm
  • Returnable: N
  • ISBN-10: 0815514662
  • Publisher Date: 01 Jan 2001
  • Binding: Hardback
  • Language: English


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