About the Book
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.
Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.
Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Table of Contents:
INTRODUCTION
Electrochemical Processing Technologies and their Impact in Microelectronic Packaging, Madhav Datta
CHIP METALLIZATION
Electroplating Process for Cu Chip Metallization, Valery M. Dubin, Harsono S. Simka, Sadasivan Shankar, Peter Moon, Thomas Marieb, and Madhav Datta
Electroless Barrier and Seed Layers for On-Chip Metallization, Valery M. Dubin, Sergey Lopatin, Amit Kohn, Nick Petrov, Moshe Eizenberg, and Yosi Shacham-Diamand
Alternative Materials for ULSI and MEMS Metallization, Yosi Shacham-Diamand, Nathan Croitoru, Alexander Inberg, Yelena Sverdlov, Valery Dubin, and Vadim Bogush
CHIP-PACKAGE INTERCONNECT
Tape Carrier and Development Trend, Osamu Yoshika, and Akira Chinda
Flip-chip Interconnection, Madhav Datta
Compliant Interconnects, Paul Kohl
Pb-free Flip-chip Technologies, D. R. Frear, and W.H. Lytle
PACKAGES AND PC BOARDS
Materials Overview in Organic Packaging, Saikumar Jayaraman, John Tang, and Vijay Wakharkar
Glass-Ceramic Packages, Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki Utsumi
Electrochemical Processes in the Fabrication of Multi-chip Modules, S. Krongelb, L.T. Romankiw, E.D. Perfecto, and K.K.H. Wong
Bumping Technology for Advanced Packages, Shinichi Wakabayashi
Plated Through Hole Technology for Boards, Haruo Akahoshi
PROCESSING TOOLS
Electroplated Contact Materials for Connectors and Relays, Yutaka Okinaka
Chemical Mechanical Planarization: From Scratch to Planar, David K. Watts, Norio Kimura, and Manabu Tsujimura
Electrochemical Deposition Equipment, Tom Ritzdorf, and Dakin Fulton
Processes and Equipment for Wet Etching and Cleaning, Jeffery W. Butterbaugh
