About the Book
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Table of Contents:
INTRODUCTION Electrochemical Processing Technologies and their Impact in Microelectronic Packaging, Madhav Datta CHIP METALLIZATIONElectroplating Process for Cu Chip Metallization, Valery M. Dubin, Harsono S. Simka, Sadasivan Shankar, Peter Moon, Thomas Marieb, and Madhav DattaElectroless Barrier and Seed Layers for On-Chip Metallization, Valery M. Dubin, Sergey Lopatin, Amit Kohn, Nick Petrov, Moshe Eizenberg, and Yosi Shacham-DiamandAlternative Materials for ULSI and MEMS Metallization, Yosi Shacham-Diamand, Nathan Croitoru, Alexander Inberg, Yelena Sverdlov, Valery Dubin, and Vadim BogushCHIP-PACKAGE INTERCONNECTTape Carrier and Development Trend, Osamu Yoshika, and Akira ChindaFlip-chip Interconnection, Madhav DattaCompliant Interconnects, Paul KohlPb-free Flip-chip Technologies, D. R. Frear, and W.H. LytlePACKAGES AND PC BOARDSMaterials Overview in Organic Packaging, Saikumar Jayaraman, John Tang, and Vijay WakharkarGlass-Ceramic Packages, Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki UtsumiElectrochemical Processes in the Fabrication of Multi-chip Modules, S. Krongelb, L.T. Romankiw, E.D. Perfecto, and K.K.H. WongBumping Technology for Advanced Packages, Shinichi WakabayashiPlated Through Hole Technology for Boards, Haruo AkahoshiPROCESSING TOOLSElectroplated Contact Materials for Connectors and Relays, Yutaka OkinakaChemical Mechanical Planarization: From Scratch to Planar, David K. Watts, Norio Kimura, and Manabu TsujimuraElectrochemical Deposition Equipment, Tom Ritzdorf, and Dakin FultonProcesses and Equipment for Wet Etching and Cleaning, Jeffery W. Butterbaugh
Review :
"Working deftly at the intersection of poststructuralism and phenomenology, Jason Farman develops the concept of the 'sensory-inscribed' body to discuss embodiment through and within mobile interfaces.a Enlivened with personal anecdotes, his accessible and theoretically savvy writing provides essential guidance to the effects that mobile media are having on important contemporary issues, from ethical quandaries to geospatial reconfigurations of social relationships." -N. Katherine Hayles, Professor of Literature, Duke University "This luminously theorized, beautifully written book provides the first comprehensive account of locative mobile media. Jason Farman offers us a distinctive, philosophically attuned perspective on the great cultural technology of our time-tracing the new relations among bodies, space, and culture." -Gerard Goggin, Professor of Media and Communications, University of Sydney "Farman's Mobile Interface Theory is the first [book] that focuses completely on theory for mobile media, and, in doing so, provides an excellent foundation for all of us interested in this area of media scholarship." -Dene Grigar, Washington State University Vancouver, in Leonardo Reviews "Farman's text represents an ambitiously thoughtful and well-written attempt to understand locative media in terms of embodied experience." -Dan Hassoun, University of Minnesota, in The International Journal of Communication WINNER OF THE 2012 ASSOCIATION OF INTERNET RESEARCHERS BOOK AWARD: "[Mobile Interface Theory] has the potential to inform new scholarship, re-set directions, and remind us that, now, the Internet is not somewhere else, but right here, in our pockets, our minds, our places." -AoIR Book Award Committee
