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Xing Wei

Xing Wei

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1.
HOW TO GET YOUR MIND ABANDON EXTERNAL ATTACHMENTS : WISDOM OF HUMAN LIFE IN MEDITATION
HOW TO GET YOUR MIND ABANDON EXTERNAL ATTACHMENTS : WISDOM OF HUMAN LIFE IN MEDITATION
By: CHAN MASTER BEN XING / MASTER ZHI WEI
Publisher: Heritage Publishers
No Review Yet
AED43
Binding:
Unknown Binding
Release:
01 Jan 2019
Language:
English
Available
Ships within 1-2 Days Explain..
2.
Unifying Electrical Engineering and Electronics Engineering
Unifying Electrical Engineering and Electronics Engineering
By: Song Xing, Suting Chen, Jingming Xia, Zhanming Wei
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED1,215
Binding:
Hardback
Release:
26 Aug 2013
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By: Xing-Chang Wei
Publisher: Taylor & Francis Ltd
No Review Yet
AED166
Binding:
Paperback
Release:
30 Jun 2020
Language:
English
Available
Ships within 20-22 Days Explain..
4.
Advances in Knowledge Discovery and Data Mining
Advances in Knowledge Discovery and Data Mining
By: Jian Pei, Jerry Chun-Wei Lin, Vincent S. Tseng, Xing Xie, De-Nian Yang
Publisher: Springer Verlag, Singapore
No Review Yet
AED364
Binding:
Paperback
Release:
25 Apr 2024
Language:
English
International Edition
Ships within 18-20 Days Explain..
5.
Advances in Knowledge Discovery and Data Mining
Advances in Knowledge Discovery and Data Mining
By: Jian Pei, Jerry Chun-Wei Lin, Vincent S. Tseng, Xing Xie, De-Nian Yang
Publisher: Springer Verlag, Singapore
No Review Yet
AED639
Binding:
Paperback
Release:
25 Apr 2024
Language:
English
International Edition
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6.
Advances in Knowledge Discovery and Data Mining
Advances in Knowledge Discovery and Data Mining
By: Jian Pei, Jerry Chun-Wei Lin, Vincent S. Tseng, Xing Xie, De-Nian Yang
Publisher: Springer Verlag, Singapore
No Review Yet
AED350
Binding:
Paperback
Release:
26 Apr 2024
Language:
English
International Edition
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7.
Advances in Knowledge Discovery and Data Mining
Advances in Knowledge Discovery and Data Mining
By: Jian Pei, Jerry Chun-Wei Lin, Vincent S. Tseng, Xing Xie, De-Nian Yang
Publisher: Springer Verlag, Singapore
No Review Yet
AED364
Binding:
Paperback
Release:
25 Apr 2024
Language:
English
International Edition
Ships within 18-20 Days Explain..
8.
Advances in Knowledge Discovery and Data Mining
Advances in Knowledge Discovery and Data Mining
By: Jian Pei, Jerry Chun-Wei Lin, Vincent S. Tseng, Xing Xie, De-Nian Yang
Publisher: Springer Verlag, Singapore
No Review Yet
AED364
Binding:
Paperback
Release:
01 May 2024
Language:
English
International Edition
Ships within 18-20 Days Explain..
9.
Advances in Knowledge Discovery and Data Mining
Advances in Knowledge Discovery and Data Mining
By: Jian Pei, Jerry Chun-Wei Lin, Vincent S. Tseng, Xing Xie, De-Nian Yang
Publisher: Springer Verlag, Singapore
No Review Yet
AED633
Binding:
Paperback
Release:
25 Apr 2024
Language:
English
International Edition
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10.
Recurrence Interval Analysis of Financial Time Series
Recurrence Interval Analysis of Financial Time Series
By: Wen-Jie Xie, Zhi-Qiang Jiang, Wei-Xing Zhou
Publisher: Cambridge University Press
No Review Yet
AED314
Binding:
Hardback
Release:
21 Mar 2024
Language:
English
International Edition
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11.
Recurrence Interval Analysis of Financial Time Series
Recurrence Interval Analysis of Financial Time Series
By: Wen-Jie Xie, Zhi-Qiang Jiang, Wei-Xing Zhou
Publisher: Cambridge University Press
No Review Yet
AED93
Binding:
Paperback
Release:
21 Mar 2024
Language:
English
Available
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12.
Exploring the Cross-Language Transfer of L1 Rhetorical Knowledge in L2 Writing
Exploring the Cross-Language Transfer of L1 Rhetorical Knowledge in L2 Writing
By: Xing Wei
Publisher: Springer Verlag, Singapore
No Review Yet
AED563
Binding:
Hardback
Release:
03 Dec 2023
Language:
English
International Edition
Ships within 14-16 Days Explain..
13.
Characterisation and Modelling of Manufacturing
Characterisation and Modelling of Manufacturing
By: Xing Zhao, Lihong Su, Peitang Wei
Publisher: Mdpi AG
No Review Yet
AED316
Binding:
Hardback
Release:
25 Apr 2023
Language:
English
International Edition
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14.
New Paradigms in Flow Battery Modelling
New Paradigms in Flow Battery Modelling
By: Qian Xu, wei Xing, Pang-Chieh Sui, Puiki Leung, Akeel A. Shah
Publisher: Springer Verlag, Singapore
No Review Yet
AED779
Binding:
Hardback
Release:
29 Aug 2023
Language:
English
International Edition
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15.
Consensus Over Switching Network Topology: Characterizing System Parameters and Joint Connectivity
Consensus Over Switching Network Topology: Characterizing System Parameters and Joint Connectivity
By: Huijun Gao, Yu Kang, Wei Xing Zheng, Jiahu Qin, Qichao Ma
Publisher: Springer Nature Switzerland AG
No Review Yet
AED611
Binding:
Paperback
Release:
29 Oct 2022
Language:
English
International Edition
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16.
Consensus Over Switching Network Topology: Characterizing System Parameters and Joint Connectivity
Consensus Over Switching Network Topology: Characterizing System Parameters and Joint Connectivity
By: Huijun Gao, Yu Kang, Wei Xing Zheng, Jiahu Qin, Qichao Ma
Publisher: Springer Nature Switzerland AG
No Review Yet
AED617
Binding:
Hardback
Release:
28 Oct 2021
Language:
English
International Edition
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17.
Lepton Photon Interactions At High Energies (Lepton Photon 2017) - Proceedings Of The 28th International Symposium
Lepton Photon Interactions At High Energies (Lepton Photon 2017) - Proceedings Of The 28th International Symposium
By: Zhi-Zhong Xing, Wei Wang
Publisher: World Scientific Publishing Co Pte Ltd
No Review Yet
AED381
Binding:
Hardback
Release:
17 Mar 2020
Language:
English
Available
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18.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By: Xing-Chang Wei
Publisher: Taylor & Francis Ltd
No Review Yet
AED454
Binding:
Hardback
Release:
25 May 2017
Language:
English
Available
Ships within 12-14 Days Explain..
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