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Feng Pan

Feng PanTapan Samaddar is a design engineer at SanDisk Corporation, where he leads the company's high-voltage circuit designs. Previously, he was employed by T-RAM, Inc., where he was involved in the design of high-speed SRAM-compatible memory chips. e is a holder of several U.S. design patents. Mr. Samaddar has also worked on high-density NOR Flash memory at Atmel Corporation, and on high-speed cache memory designs at ST Microelectronics.

Feng Pan is doing circuit design at SanDisk Corporation, where he is involved in defining the architecture and implementing charge pumps and related high-voltage circuits over several generations of NAND Flash memory products. He is aholder of 17 U.S. design patents. Mr. Pan previously worked at AMD, where he contributed to the company's NOR Flash memory chip designs. He holds an MS degree from Stanford University and a BS degree from U.C. Berkeley. Read More Read Less

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1.
Particle Swarm Optimizer and Multi-Objective Optimization
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AED416
Binding:
Hardback
Release:
03 Jan 2026
Language:
English
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2.
Tensor Computation for Seismic Data Processing
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AED831
Binding:
Hardback
Release:
27 Apr 2025
Language:
English
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3.
Multi-Modal EEG Monitoring of Severely Neurologically Ill Patients
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AED723
Binding:
Hardback
Release:
24 Oct 2021
Language:
English
International Edition
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4.
Charge Pump IC Design
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AED748
Binding:
Hardback
Release:
16 Mar 2015
Language:
English
International Edition
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5.
An Ontology of Time
Publisher: VDM Verlag
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AED245
Binding:
Paperback
Release:
15 Mar 2009
Language:
English
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6.
E-Learning and Games
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AED183
Binding:
Paperback
Release:
04 Jun 2016
Language:
English
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7.
Contemporary Nuclear Shell Models
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AED225
Binding:
Paperback
Release:
13 Nov 2013
Language:
English
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8.
Charge Pump Circuit Design
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AED646
Binding:
Hardback
Release:
16 Aug 2006
Language:
English
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9.
Charge Pump Circuit Design
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AED0
Binding:
Digital (delivered electronically)
Release:
01 Jan 2006
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10.
Efficient Algorithms in Analyzing Genomic Data.
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AED238
Binding:
Paperback
Release:
01 Sep 2011
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11.
Multi-Modal EEG Monitoring of Severely Neurologically Ill Patients
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AED252
Binding:
Paperback
Release:
25 Oct 2022
Language:
English
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12.
Charge Pump IC Design
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AED524
Binding:
Digital (delivered electronically)
Release:
27 Jul 2015
Language:
English
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13.
This Is Not Available 008547
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AED255
Binding:
Paperback
Release:
03 Sep 2011
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14.
High-Performance Ceramics III
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AED761
Binding:
Digital download and online
Release:
15 Feb 2007
Language:
English
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15.
High-Performance Ceramics III
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AED1,961
Binding:
Paperback
Release:
01 Dec 2004
Language:
English
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