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Steven M Durbin

Steven M DurbinSteven M. Durbin received the B.S., M.S. and Ph.D. degrees in Electrical Engineering from Purdue University, West Lafayette, Indiana. Subsequently, he was with the Department of Electrical Engineering at Florida State University and Florida A&M Univesity before joining the University of Canterbury, New Zealand, in 2000. In 2010, he moved to the University at Buffalo, The State University of New York, where he held a joint tenured appointment between the Departments of Electrical Engineering and Physics. Since 2013, he has been with the Department of Electrical and Computer Engineering at Western Michigan University, where he is Professor of Electrical and Computer Engineering, and has served in a variety of administrative roles. His teaching interests include circuits, electronics, electromagnetics, solid-state electronics and nanotechnology. His research interests are primarily concerned with the development of novel electronic materials--in particular those based on oxide and nitride compounds--as well as studying disorder in both naturally occurring and synthetic systems as a route to physical understanding and engineering of properties. He is a founding principal investigator of the MacDiarmid Institute for Advanced Materials and Nanotechnology, a New Zealand National Centre of Research Excellence, and coauthor of over 100technical publications, including several patents and patents pending. He is a senior member of the IEEE, and a member of Eta Kappa Nu, Tau Beta Pi, the Materials Research Society, the AVS (formerly the American Vacuum Society), the Society of Amateur Radio Astronomers, the American Physical Society, and the Royal Society of New Zealand. In his spare time, he enjoys building acoustic and electric guitars, and solid-top ukuleles. Read More Read Less

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1.
Engineering Circuit Analysis || 10th Edition
Publisher: McGraw Hill
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AED73
Binding:
Paperback
Release:
2024-10-25
Language:
English
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3.
Loose Leaf for Engineering Circuit Analysis
Publisher: OM Book Service
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AED951
Binding:
Loose-leaf
Release:
25 Jan 2023
Language:
English
International Edition
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4.
Oxide Semiconductors and Thin Films: Volume 1494
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AED381
Binding:
Hardback
Release:
28 Oct 2013
Language:
English
International Edition
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Zinc Oxide and Related Materials — 2009: Volume 1201
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AED270
Binding:
Hardback
Release:
31 Mar 2010
Language:
English
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Engineering Circuit Analysis
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AED181
Binding:
SA
Release:
/11/2001
Language:
English
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Engineering Circuit Analysis
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06 Jul 2010
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Engineering Circuit Analysis
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20 Feb 2007
Language:
English
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Loose Leaf Engineering Circuit Analysis
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Loose-leaf
Release:
07 Aug 2012
Language:
English
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Loose Leaf for Engineering Circuit Analysis
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AED749
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Loose-leaf
Release:
23 Mar 2018
Language:
English
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11.
Connect Access Card for Engineering Circuit Analysis
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AED409
Binding:
Digital online
Release:
09 Aug 2011
Language:
English
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Package: Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card
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Connect 1 Semester Access Card for Engineering Circuit Analysis
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Connect 2 Semester Access Card for Engineering Circuit Analysis
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