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1.

Engineering Circuit Analysis (Edition10)

By: Jack E. Kemmerly, Steven M. Durbin, Jamie D. Phillips, William H. Hayt, Jr

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AED76

Binding:	Paperback
Release:	10 Oct 2024
Language:	English

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2.

ENGINEERING CIRCUIT ANALYSIS, 9TH EDITION

By: Jr., William H. Hayt|Kemmerly, Jack E.|Phillips, Jamie D.|Durbin, Steven M., Durbin, Steven M., Kemmerly, Jack E., Phillips, Jamie D., Jr., William H. Hayt

Publisher: McGraw Hill

3.7

(3)

AED81

Binding:	Paperback
Release:	05 Nov 2020
Language:	English

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3.

Loose Leaf for Engineering Circuit Analysis

By: William H Hayt, Steven M Durbin, Jack E Kemmerly, Jamie D Phillips

Publisher: OM Book Service

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AED845

Binding:	Loose-leaf
Release:	25 Jan 2023
Language:	English

International Edition

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4.

Zinc Oxide and Related Materials — 2009: Volume 1201

By: Holger Von Wenckstern, Martin W. Allen, Steven M. Durbin

Publisher: Materials Research Society

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AED248

Binding:	Hardback
Release:	31 Mar 2010
Language:	English

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5.

Oxide Semiconductors and Thin Films: Volume 1494

By: Tim Veal, Martin Allen, Steven M. Durbin, Craig B. Arnold, Nini Pryds

Publisher: Materials Research Society

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AED367

Binding:	Hardback
Release:	28 Oct 2013
Language:	English

International Edition

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6.

Engineering Circuit Analysis

By: William H. Hayt, Jack E. Kemmerly, Steven M. Durbin, Steven Durbin

Publisher: McGraw-Hill Education - Europe

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AED153

Binding:	SA
Release:	01 Nov 2001
Language:	English

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7.

Engineering Circuit Analysis

By: Steven M. Durbin, W Hayt, J Kemmerly

Publisher: McGraw Hill Education India

5.0

(2)

AED21

Binding:	Paperback
Release:	06 Jul 2010

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8.

Engineering Circuit Analysis

By: Steven M. Durbin, William Hayt , Jack Kemmerly

Publisher: McGraw-Hill Science/Engineering/Math

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AED781

Binding:	Paperback
Release:	20 Feb 2007
Language:	English

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9.

Connect 2 Semester Access Card for Engineering Circuit Analysis

By: William H Hayt, Jack Kemmerly , Steven M Durbin

Publisher: McGraw-Hill Education

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AED107

Binding:	LB
Release:	04 Apr 2018
Language:	English

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10.

Connect 1 Semester Access Card for Engineering Circuit Analysis

By: William H Hayt, Jack Kemmerly , Steven M Durbin

Publisher: McGraw-Hill Education

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AED33

Binding:	LB
Release:	04 Apr 2018
Language:	English

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11.

Package: Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card

By: William H Hayt, Jack Kemmerly , Steven M Durbin

Publisher: McGraw-Hill Education

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AED30

Binding:	Loose-leaf
Release:	23 May 2012
Language:	English

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12.

Loose Leaf for Engineering Circuit Analysis

By: William H Hayt, Jack Kemmerly , Steven M Durbin

Publisher: McGraw Hill Education India

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AED629

Binding:	Loose-leaf
Release:	23 Mar 2018
Language:	English

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13.

Connect Access Card for Engineering Circuit Analysis

By: William H Hayt, Jack Kemmerly , Steven M Durbin

Publisher: McGraw-Hill Education

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AED344

Binding:	Digital online
Release:	09 Aug 2011
Language:	English

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14.

Loose Leaf Engineering Circuit Analysis

By: William H Hayt, Jack Kemmerly , Steven M Durbin

Publisher: McGraw-Hill Education

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AED788

Binding:	Loose-leaf
Release:	07 Aug 2012
Language:	English

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