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1.
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
By: Shuye Zhang, Guoli Sun
Publisher: Institution of Engineering and Technology
No Review Yet
AED643
Binding:
Hardback
Release:
01 Jul 2025
Language:
English
International Edition
Ships within 14-16 Days Explain..
2.
Hybrid Nanomaterials
Hybrid Nanomaterials
By: Peng He, Rafael Vargas-Bernal, Shuye Zhang
Publisher: InTechOpen
No Review Yet
AED575
Binding:
Hardback
Release:
10 Jun 2020
Language:
English
International Edition
Ships within 12-14 Days Explain..
3.
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
By: Shuye Zhang, Guoli Sun
Publisher: Institution of Engineering and Technology
No Review Yet
AED586
Binding:
Digital download and online
Release:
15 Jun 2025
Language:
English
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