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Guoli Sun

Guoli Sun

Guoli Sun is currently pursuing a Ph.D. at Harbin Institute of Technology, where his research focuses on material and structural reliability in advanced electronic packaging, as well as the mechanical characterization and performance analysis of vrious materials.

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1.
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
By: Shuye Zhang, Guoli Sun
Publisher: Institution of Engineering and Technology
No Review Yet
AED531
Binding:
Hardback
Release:
01 Jul 2025
Language:
English
International Edition
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2.
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
By: Shuye Zhang, Guoli Sun
Publisher: Institution of Engineering and Technology
No Review Yet
AED586
Binding:
Digital download and online
Release:
15 Jun 2025
Language:
English
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