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1.
Simulation and Reliability Assessment of Advanced Packaging
Simulation and Reliability Assessment of Advanced Packaging
By: Kuo-Ning Chiang
Publisher: Mdpi AG
No Review Yet
AED337
Binding:
Hardback
Release:
30 Apr 2024
Language:
English
International Edition
Ships within 12-14 Days Explain..
2.
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
By: John Lau, Kuo-Ning Chiang
Publisher: Springer Verlag, Singapore
No Review Yet
AED916
Release:
05 Mar 2026
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