Buy books written by Kuo-Ning Chiang Available at Bookswagon
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Kuo-Ning Chiang

Kuo-Ning Chiang

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1.
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
By: John Lau, Kuo-Ning Chiang
Publisher: Springer Verlag, Singapore
No Review Yet
AED960
Binding:
Hardback
Release:
01 Jun 2026
Language:
English
International Edition
Ships within 18-20 Days Explain..
2.
Simulation and Reliability Assessment of Advanced Packaging
Simulation and Reliability Assessment of Advanced Packaging
By: Kuo-Ning Chiang
Publisher: Mdpi AG
No Review Yet
AED350
Binding:
Hardback
Release:
30 Apr 2024
Language:
English
International Edition
Ships within 10-12 Days Explain..
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