Buy books written by Jennie Hwang Available at Bookswagon
Logo1
close menu
Bookswagon
search
My Account
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
humburger icon Categories

Refine your Search

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
Jennie Hwang

Jennie Hwang McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

9 results found
Filter0Switch to Grid View
List viewGrid view
Sort By:
1.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging
By: Jennie S. Hwang
Publisher: Springer
No Review Yet
AED224
Binding:
Paperback
Release:
20 Feb 2012
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging
By: Jennie Hwang
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED448
Binding:
Paperback
Release:
24 Sep 1992
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Implementing Lead-Free Electronics
Implementing Lead-Free Electronics
By: Jennie Hwang
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED251
Binding:
Hardback
Release:
16 Jan 2005
Language:
English
Available
Ships within 10-12 Days Explain..
4.
Lead-free solder composition
Lead-free solder composition
By: Jennie S Hwang
Publisher: Independently Published
No Review Yet
AED48
Binding:
Paperback
Release:
30 Nov 2020
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
5.
Modern Solder Technology for Competitive Electronics Manufacturing
Modern Solder Technology for Competitive Electronics Manufacturing
By: Jennie Hwang
Publisher: McGraw-Hill Education - Europe
No Review Yet
AED199
Binding:
Hardback
Release:
30 May 1996
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
6.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging
By: Jennie Hwang
Publisher: Springer My Copy UK
No Review Yet
AED88
Binding:
Paperback
Release:
24 Sep 1992
Out of Stock
Notify me when this book is in stockNotify Me
7.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging
By: Jennie S. Hwang
Publisher: Kluwer Academic Publishers Group
No Review Yet
AED310
Binding:
Hardback
Release:
/04/1989
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
8.
Ball Grid Array and Fine Pitch Peripheral Interconnections
Ball Grid Array and Fine Pitch Peripheral Interconnections
By: Jennie S. Hwang
Publisher: Electrochemical Publications Ltd
No Review Yet
AED327
Binding:
Hardback
Release:
/02/1995
Out of Stock
Notify me when this book is in stockNotify Me
9.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging
By: Jennie S Hwang
Publisher: Springer My Copy UK
No Review Yet
AED88
Binding:
Paperback
Release:
27 Apr 1989
Out of Stock
Notify me when this book is in stockNotify Me
No more records found