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Modern Solder Technology for Competitive Electronics Manufacturing

Modern Solder Technology for Competitive Electronics Manufacturing


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About the Book

Solder is the common interconnecting material for electronic packaging and assembly, providing electrical, thermal and mechanical functions. This text provides coverage of all relevant technologies related to the applications of solder, covering the fundamental principles involved in each process, but also relating those principles to the execution of practical applications. It also provides the working solder knowledge needed to implement an electronic manufacturing system using any of the new technologies available.

Table of Contents:
Introduction. Advanced Surface Mount Technology and Die Attach Techniques. Solder Material. Soldering Chemistry. Solderability. Microstructure of Solders. Aqueous-Cleaning Manufacture. No-Clean Manufacture. Protective and Reactive Atmosphere Soldering. Surface Mount Fine Pitch Technology. Surface Mount-BGA/PAC Technology. Soldering Methodology and Equipment. Soldering and Soldering Related Issues. Strengthened Solders. Lead-Free Solders. Solder Joint Failure Mode. Solder Joint Failure Assessment-Case Studies. Solder Joint Quality and Reliability. New and Emerging Specifications and Standards. Future Trends.

About the Author :
McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide


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Product Details
  • ISBN-13: 9780070317499
  • Publisher: McGraw-Hill Education - Europe
  • Publisher Imprint: McGraw-Hill Professional
  • Height: 236 mm
  • No of Pages: 622
  • Spine Width: 51 mm
  • Width: 155 mm
  • ISBN-10: 0070317496
  • Publisher Date: 30 May 1996
  • Binding: Hardback
  • Language: English
  • Returnable: N
  • Weight: 1196 gr


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