Boundary Elements and Other Mesh Reduction Methods
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Boundary Elements and Other Mesh Reduction Methods

Boundary Elements and Other Mesh Reduction Methods

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About the Book

The International Conference on Boundary Element and other Mesh Reduction Methods is now in its 29th year. The papers presented at the conference are contained in this volume. The continued success of this important meeting is due to the strength of the work carried out by the community since the original conference took place in Southampton in 1978. The current meeting continues with the tradition of innovation and quality, which have been the trademarks of these conferences. The book contains a series of important sections including: meshless techniques, advanced formulations, dual reciprocity method, computational issues, fluid mechanics applications, heat and mass transfer, plates and shells, wave propagation, damage mechanics and fracture, electrical engineering & electromagnetics and inverse problems.

Table of Contents:
Section 1: Meshless techniques Stress analysis by local integral equations; Non-overlapping domain decomposition scheme for the symmetric radial basis function meshless approach with double collocation at the sub-domain interfaces; Initial stress formulation for three-dimensional elastoplastic analysis by the triple reciprocity boundary element method; A meshless solution for potential equations using a continuous-valued circular line source; Adaptive error estimation of the Trefftz method for solving the Cauchy problem Section 2: Advanced formulations New boundary element analysis of acoustic problems with the fictitious eigenvalue issue; A BEM formulation of free hexagons based on dynamic equilibrium; Introduction of STEM for stress analysis in statically determined bodies; Null-field integral equations and their applications Section 3: Dual reciprocity method Hybrid BEM for the early stage of a 3D unsteady heat diffusion process; Evaluation of strong shear thinning non-Newtonian fluid flow using single domain DR-BEM; DRM-MD approach for bound electron states in semiconductor nano-wires Section 4: Computational issues Comparison of radial basis functions in evaluating the Asian option; Inmost singularities and appropriate quadrature rules in the boundary element method; Parallelized iterative domain decomposition boundary element method for thermoelasticity Section 5: Fluid mechanics applications Flow over a square cylinder by BEM; Meshless analysis of flow and concentration in a water reservoir; Numerical analysis of compressible fluid flow in a channel with sharp contractions Section 6: Heat and mass transfer Multiscale simulation coupled DRBEM with FVM for the two-phase flow with phase change process of micrometer scale particles; Boundary Element Method for double diffusive natural convection in a horizontal porous layer Section 7: Plates and shells Analysis of von Karman plates using a BEM formulation; Linear analysis of building floor structures by a BEM formulation based on Reissner's theory Section 8: Wave propagation Time and space derivatives in a BEM formulation based on the CQM with initial conditions contribution; A method for obtaining a sparse matrix from the volume integral equation for elastic wave propagation Section 9: Damage mechanics and fracture Two-parameter concept for anisotropic cracked structures; Coupled FEM-BEM crack growth analysis Section 10: Electrical engineering and electromagnetics Electromagnetic modeling of a lightning rod; The analysis of TM-mode and TE-mode optical responses of metallic nanostructures by new surface integral equations; Measures for the postprocessing of grounding electrodes transient response Section 11: Inverse problems Singular superposition elastostatics BEM/GA algorithm for cavity detection; Numerical solution of an inverse problem in magnetic resonance imaging using a regularized higher-order boundary element method


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Product Details
  • ISBN-13: 9781845642808
  • Publisher: WIT Press
  • Publisher Imprint: WIT Press
  • ISBN-10: 1845642805
  • Publisher Date: 30 May 2007
  • Binding: Digital (delivered electronically)


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