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Electronic Equipment Packaging Technology

Electronic Equipment Packaging Technology


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About the Book

This practical guide seeks to provide a comprehensive overview of the fundamentals of design, fabrication and assembly of electronic equipment packages with the focus on competitive, stable product development. Its easy-to-use tutorial format keeps theory to a minimum. The first part addresses basic package elements and surveys the most significant new technologies in this rapidly growing field. Part Two deals with the design, materials selection, and process implementation for low-cost, high-performance packaging. It shows how modern packaging technology relates to final product performance, and helps readers master value analysis, testing, and life-cycle costing. A chapter on system integration brings the electronics package into the full system of both consumer and military products. This book should be of interest to electronics engineers and mechanical engineers working in the design and fabrication of electronics packages; engineers and managers involved in cost management and product development.

Table of Contents:
1 Packaging Implementation.- 1.1 Related General Packaging Issues.- 1.2 Levels of Packaging.- 1.3 Design Implementation Team.- 1.4 Product Applications.- 1.5 Packaging Priorities.- References.- 2 Integrated Circuits.- 2.1 Process Technology.- 2.2 Application-Specific Integrated Circuits.- References.- 3 Circuit Component Packages.- 3.1 Electronic Circuit Components.- 3.2 Electromechanical Circuit Components.- 3.3 Mechanical Circuit Component Hardware.- References.- 4 Multiple Bare Die Packaging Technologies.- 4.1 Bare-Die Termination Techniques.- 4.2 Hybrid Microcircuits.- 4.3 Chip-on-Board Technology.- 4.4 Multichip Modules.- References.- 5 Packaged Component Subassemblies.- 5.1 Electrical Performance.- 5.2 Packaging and Interconnecting (P&I) Structures.- 5.3 General Assembly Selection Considerations.- 5.4 Through-hole Technology.- 5.5 Surface Mount Technology (SMT).- References.- 6 Subassembly Interconnection Systems.- 6.1 Backplane Structures.- 6.2 Backplane Connectors.- 6.3 Discrete Solderless-wrap Backplane Wiring.- References.- 7 Wiring and Cabling Assemblies.- 7.1 Electrical Characteristics.- 7.2 Wire and Cable Materials.- 7.3 Wire and Cable Configurations.- 7.4 Cabling Connectors.- 7.5 Wire Terminations.- References.- 8 Electronic Equipment Enclosures.- 8.1 General Enclosure Selection Considerations.- 8.2 Cabinets.- 8.3 Small Equipment Enclosures.- 8.4 Portable Carrying Cases.- 8.5 Printed Board Enclosures.- References.- 9 Thermal Management.- 9.1 Basic Thermal Management Considerations.- 9.2 General Thermal Analysis.- 9.3 Heat Sinks.- 9.4 Air Movers (Fans and Blowers.- 9.5 Liquid Cooling.- 9.6 Thermoelectric Heat Pump Modules.- References.- 10 End Product Applications.- 10.1 Consumer Electronics.- 10.2 Data Processing Equipment (Computers).- 10.3 Aircraft (Avionics) Equipment.- 10.4 Military Shipboard Electronics.- 10.5 Biomedical Electronics.- References.


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Product Details
  • ISBN-13: 9780442238186
  • Publisher: Kluwer Academic Publishers Group
  • Publisher Imprint: Kluwer Academic Publishers
  • Height: 235 mm
  • No of Pages: 279
  • Width: 155 mm
  • ISBN-10: 0442238185
  • Publisher Date: 27 Feb 1992
  • Binding: Hardback
  • Language: English
  • Returnable: Y


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