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Home > Science, Technology & Agriculture > Electronics and communications engineering > Electronics engineering > Electronic devices and materials > Liquid Crystal Flat Panel Displays: Manufacturing Science and Technology
Liquid Crystal Flat Panel Displays: Manufacturing Science and Technology

Liquid Crystal Flat Panel Displays: Manufacturing Science and Technology


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About the Book

We live in the silicon age, and the quintessential item that defines our world is the computer. Silicon chips power the computer as well as many other products for work and leisure, such as calculators, radios, and televisions. In the forty years since the transistor was invented, the solid state revolution has affected the lives of almost everyone in the world. Based on silicon, solid state devices and integrated circuits have revolutionized electronics, data processing, communica- tions, and the like. The computer, especially the personal computer, would be impossible without silicon devices. Only one computer was ever built using vacuum tubes, and the tubes had to be constantly replaced because they generated too much heat and burned out. Silicon devices allowed for reliable switching operations in arrays of hundreds and thousands of discrete devices. As a result, the very substantial industrial base that existed for producing vacuum tubes disappeared -with one exception. That exception is, of course, the CRT, which is evident in televisions, computer displays, and a host of other information display terminals. Until recently, there was nothing that could take its place, and it seemed that the CRT would remain as the electronic medium for all except the simplest displays. The CRT is about to go the way of the other vacuum tubes. It's dead, but doesn't know it yet.

Table of Contents:
One Large Area Liquid Crystal Displays.- 1.1 Computer Displays.- 1.1.1 Desktop Computers.- 1.1.2 Portable Computers.- 1.1.3 Engineering Workstations.- 1.1.4 Computer Display Summary.- 1.2 Television Displays.- 1.2.1 Portable TVs.- 1.2.2 Projection Displays.- 1.2.3 High Definition TV.- 1.2.4 Video Camera Viewfinders.- 1.3 Automotive Applications.- 1.4 Other Applications.- 1.5 Liquid Crystal Display Technology.- 1.5.1 Types of Liquid Crystal Display.- 1.5.2 Passive vs Active Addressing.- 1.5.3 Workstation B/W Display.- 1.5.4 Polymer Dispersed Displays.- 1.5.5 Automotive Display.- 1.6 Active Matrix Devices.- 1.6.1 Two Terminal Devices.- 1.6.2 Amorphous Silicon Transistors.- 1.6.3 Polysilicon Transistors.- 1.6.4 Comparison of Device Performance.- 1.6.5 Ferroelectric Polymer.- 1.6.6 Printed Transistors.- 1.7 Display Manufacturers.- 1.7.1 Japan.- Current Suppliers.- 1.7.2 USA.- Xerox.- Department of Defense Initiatives.- IBM.- Advanced Display Manufacturers.- Others.- 1.7.3 Rest Of World.- Europe.- Korea.- Other Asian Firms.- References.- Figures.- 1-1 Portable and laptop computers.- 1-2 Active matrix liquid crystal display screen size in recent years.- 1-3 Pixel count versus display diagonal size for flat panels.- 1-4 No. of pixels & display diagonal for high information content displays.- 1-5 Basic liquid crystal polymer molecule.- 1-6 Principle of operation of a twisted nematic liquid crystal display.- 1-7 Transmission versus voltage curves for TN and STN materials.- 1-8 Schematic representation of passive and active matrix color LCD's.- 1-9 Polymer dispersed liquid crystal projection TV system.- 1-10 Structure of the dispersed liquid crystal droplets.- 1-11 Projection display using polysilicon thin film transistors.- 1-12 Amorphous silicon PIN diode.- 1-13 MIM diode structure.- 1-14 Double pixel design for MIM diode.- 1-15 Cross-section view of three TFT configurations.- 1-16 Aluminum gate a-Si TFT.- 1-17 Light leakage in TFT structure.- 1-18 Plan view of TFT structure with light shield.- 1-19 Hitachi TFT array equivalent circuit.- 1-20 Relative cost of silicon TFT processes.- 1-21 Data rate of driver circuits for complex TFT displays.- 1-22 Construction of ferroelectric matrix active device.- 1-23 LCD panel structure with ferroelectric matrix device.- 1-24 Comparison of photolithography and printing for imaging on FPD's.- 1-25 Photoresist application by offset printing.- 1-26 Polysilicon transistors made by offset printing and photolithography.- Tables.- 1-1 Classification of Portable Computers.- 1-2 Japanese Large Flat Panel Displays.- 1-3 Japanese LCD TV and VCR Displays.- 1-4 Calculation of S for various values of Nmax.- 1-5 Requirements for Vertical TN LCD Display.- 1-6 Types of Liquid Crystal Displays.- 1-7 Processing and Relative Cost of Active and Passive Displays.- 1-8 TFT Array Process and Specifications.- 1-9 Resistivity of Metals.- 1-10 Comparison of a-Si and poly-Si TFTs.- 1-11 Polysilicon Fabrication Methods and TFT Properties.- 1-12 Comparison of TFT, PIN Diode, and MIM Diode Displays.- 1-13 CMOS poly-Si TFT and a-Si:H TFT Comparison.- 1-14 AMLCD Drive Circuit Types.- 1-15 Characteristics of Ferroelectric Liquid Crystal Display.- 1-16 Liquid Crystal Display Status in Japan.- 1-17 Advanced Display Manufacturers Association Members.- 1-18 US Liquid Crystal Display Activity.- 1-19 European LCD Activity.- 1-20 Liquid Crystal Display Status in Korea.- 1-21 LCD Manufacturing in Asia.- Two Display Manufacturing Process.- 2.1 Color Filter Manufacturing.- 2.1.1 Glass Substrate Preparation.- Glass Fabrication.- Cutting, Beveling, Polishing.- Annealing.- Cleaning.- ITO Deposition.- 2.1.2 Color Filter Process.- Black Matrix Definition.- Dye Method.- Pigment Method.- Electrodeposition.- Printing.- Overcoating.- ITO Deposition.- 2.2 Active Matrix Display Manufacturing.- 2.2.1 Thin Film Transistor Manufacturing.- Plasma CVD & Sputtering.- Photolithography.- Etching.- Transistor Processes.- 2.2.2 In Process Testing.- Optical Inspection.- Electrical Inspection.- Functional Inspection.- 2.2.3 Defect Repair.- 2.3 Display Assembly.- 2.3.1 Orientation Film Deposition and Rubbing.- 2.3.2 Seal Printing.- 2.3.3 Spacer Placement and Sealing.- 2.3.4 Liquid Crystal Injection.- 2.3.5 Inspection and Test.- 2.3.6 Polarizer Attach.- 2.3.7 Die Attach.- 2.3.8 Backlight.- 2.4 Display Manufacturing.- 2.4.1 STN Display Manufacturing.- 2.4.2 Color Filter Manufacturing.- 2.4.3 Equipment for Color Filter Manufacturing.- 2.5 AMLCD Factory.- 2.5.1 Throughput and Productivity.- 2.5.2 Manufacturing Cost and Yield.- Yield vs ASP.- Manufacturing Cost Model.- Manufacturing Yield Model.- AMLCD Factory.- Figures.- 2-1 Schematic outline of the display manufacturing process.- 2-2 Fusion process for glass sheet formation.- 2-3 Thermal expansion of Corning 7059 glass.- 2-4 Thermal shrinkage of NA 35 glass: heat treatment time & temperature.- 2-5 Cleaning methods evaluated by contact angle measurement.- 2-6 Sputtering voltage, deposition temperature, and ITO film resistivity.- 2-7 Plasma-assisted electron beam evaporation equipment.- 2-8 Color Filter Formation.- 2-9 Active Device Formation.- 2-10 Photoresist adhesion by side etch for various precoating processes.- 2-11 Cross-section view of three TFT configurations.- 2-12 Assembly, Packaging & Test.- 2-13 Automated flat panel assembly line.- 2-14 Variations in external pressure & spacer size lead to cell gap variations.- 2-15 Active matrix liquid crystal display cross section.- 2-16 Packaging configurations in flat panel displays.- 2-17 Number and pitch of leads for flat panel displays.- 2-18 Connection of TAB tape to flat panel leads w/ anisotropic conductive paste.- 2-19 Schematic of backlight arrangement with light pipe.- 2-20 Factory layout for passive matrix LCD manufacturing.- 2-21 Simulated yield curves: defect densities in TFT manufacturing.- 2-22 Cost components of flat panel display production.- 2-23 NEC two story AMLCD fabrication facility layout.- Tables.- 2-1 Glass Substrates for Flat Panel Display Manufacturing.- 2-2 Glass Substrate Specification for Active Matrix Display.- 2-3 Proposed Substrate Standard Sizes for Flat Panel Displays.- 2-4 Cleaning Processes for Flat Panel Displays.- 2-5 DI Water Quality and Substrate Particle Count.- 2-6 Types of Color Filters for LCDs.- 2-7 Color Filter Process Comparison.- 2-8 Process Flow Chart for Inverted-Staggered Back Channel Etched TFT.- 2-9 Inverted-Staggered Trilayered TFT Process.- 2-10 Process Flow for Normal Staggered TFT.- 2-11 TFT Array Process and Specifications.- 2-12 Defects in LCD TFT Array Manufacturing.- 2-13 Causes of Defects in Assembled Flat Panel Displays.- 2-14 Clean room Conditions for STN Process Line.- 2-15 Production Lines for Large Liquid Crystal Displays in Japan.- 2-16 AMLCD Equipment Productivity and Price.- 2-17 AMLCD Production Equipment Categories.- 2-18 In-Process Inspection and Repair Equipment List.- 2-19 Assembly and Die Attach Equipment.- 2-20 TFT Array Yield Summary (No Repair).- Three Materials for Flat Panel Displays.- 3.1 Glass Substrates.- 3.2 ITO Sputtering.- 3.2.1 ITO Powder and Thin Film Properties.- 3.3 Other Sputtering Materials.- 3.4 Color Filters.- 3.4.1 Dye Method.- 3.4.2 Pigment Dispersion.- 3.4.3 Electrodeposition.- 3.4.4 Electromist.- 3.4.5 Overcoat.- 3.4.6 Two Color Approach.- 3.5 Process Chemicals & Gases.- 3.6 Photoresists.- 3.7 Photomasks.- 3.8 Orientation Films.- 3.8.1 Polyimide Orientation Films.- 3.9 Spacers.- 3.10 Sealing Materials.- 3.11 Liquid Crystals.- 3.11.1 Other Liquid Crystal Materials.- 3.11.2 Polymer Dispersed Displays.- 3.11.3 Polymer Network Displays.- 3.12 Polarizers/Compensation Films.- 3.13 Die Attach/Connector Materials.- 3.14 Display Backlighting.- References.- Figures.- 3-1 CIE Chromaticity Diagram for color filters.- 3-2 Resistance to fading of dyed and printed color filters.- 3-3 Comparison of spin-coated and printed filter element.- 3-4 Transmittance of green pigment material / function of particle size.- 3-5 Schematic of electrodeposition process for color filters.- 3-6 Synthesis and structure of aliphatic soluble polyimide.- 3-7 Glass fiber spacer size distribution.- 3-8 Typical liquid Crystal.- 3-9 Nematic phase.- 3-10 Cholesteric phase.- 3-11 Smectic phase.- 3-12 Structure & properties of difluorobenzene derivatives.- 3-13 Trans-4-n-pentylcyclohexyl (PCH-5) derivatives.- 3-14 Structure of polarizer film for LCD.- 3-15 Polarizer film structures.- 3-16 Transmittance vs polarization efficiency.- 3-17 Heat seal connector construction.- 3-18 Usage ratio of TAB ICs.- 3-19 IC bonding methods in chip on glass packaging.- 3-20 Construction of WedgeLightTM backlight.- 3-21 Spatial brightness uniformity of Wedgelight TM.- 3-22 Flat fluorescent lamp structure.- Tables.- 3-1 LCD Glass Supplier Matrix in Japan.- 3-2 ITO Film Properties.- 3-3 Characteristics of ITO Targets.- 3-4 Glass Substrates for Liquid Crystal Displays.- 3-5 Specifications for High Density ITO Target.- 3-6 Properties of Color Filters.- 3-7 Test Conditions for Color Filters.- 3-8 Alternative Methods of Color Filter Formation.- 3-9 Solubility of Cleaning Chemicals.- 3-10 Particles in Electronic Chemicals.- 3-11 DI Water Quality.- 3-12 Measurement of Cleaning Efficiency.- 3-13 Alignment Film Material Requirements.- 3-14 Comparison of Polyimides for Orientation Film Applications.- 3-15 Plastic Spacer Size Variation.- 3-16 Plastic Spacer Thermal Expansion Coefficient.- 3-17 Parameters Specified in Liquid Crystal Formulations.- 3-18 Relation Between UV Exposure and Turn On Voltage.- 3-19 Polarizing Film Structures.- 3-20 STN Display Cost.- 3-21 Comparison of Backlight Technologies.- Four Manufacturing Equipment.- 4.1 Substrate Cleaning.- 4.2 Photoresist Application/Baking.- 4.2.1 Spin Coating.- 4.2.2 Roll Coating.- 4.2.3 Conveyor Ovens.- 4.3 Photolithography.- 4.3.1 Steppers.- 4.3.2 Mirror Projection.- 4.4 Etching/Stripping.- 4.4.1 Wet Etch Equipment.- 4.4.2 Plasma Etching/Ashing.- 4.5 Thin Film Deposition.- 4.5.1 Sputtering.- 4.5.2 Chemical Vapor Deposition.- 4.5.3 Plasma CVD.- 4.5.4 LPCVD and APCVD.- 4.5.5 Thermal Processing.- 4.5.6 Ion Implant/Doping.- Phased Linear Scanner.- Ion Flux Doping.- 4.6 Test Equipment.- 4.6.1 Visual and Functional Test.- 4.6.2 Optical Imaging.- Optical Image Processing Equipment.- Digital Image Processing Equipment.- 4.6.3 Electrical Evaluation.- Transfer Admittance.- IBM Test Set.- 4.6.4 Voltage Imaging.- 4.7 TFT Repair.- 4.7.1 Laser Cutting.- 4.7.2 Laser-Assisted Deposition.- 4.8 Assembly.- 4.8.1 Polymer Printing.- 4.8.2 Assembly/Final Test.- 4.8.3 Die/PCB Attach.- References.- Figures.- 4-1 Mirror projection schematic diagram.- 4-2 Example of PECVD system for thin film deposition.- 4-3 Deposition chamber cutaway schematic.- 4-4 Cross section of PEVD electrode.- 4-5 Plan view of phased linear scanner showing two substrates.- 4-6 Cross-section view of linear scanner end station.- 4-7 Ion bucket source and deposition chamber schematic.- 4-8 Optical pattern filtering for defect imaging.- 4-9 Transfer admittance testing.- 4-10 Schematic diagram of voltage imaging of a TFT array.- 4-11 Laser connect and disconnect alternatives.- 4-12 Laser connect and disconnect using polysilicon.- 4-13 Polymer printing schematic.- Tables.- 4-1 Canon MPA-2000 Specifications.- 4-2 Nextral NE550 RIE System Specifications.- 4-3 Dry Etch Systems.- 4-4 Ulvac SDT-VT In-line Sputtering Systems.- 4-5 CVD Systems and Suppliers.- 4-6 Anelva In-Line Plasma CVD Systems.- 4-7 Amorphous Silicon Deposition.- 4-8 Nextral ND 400 PECVD System Specifications.- 4-9 LPCVD Silicon Films (Leybold LC350 Reactor).- 4-10 Watkins-Johnson SiO2 Deposition System.- 4-11 KLA Acrotec 6000 Parameters.- 4-12 Spin Coating vs Print Coating.- 4-13 L-400 Rubbing Machine.- 4-14 Villa Precision GS 110 16 L Scriber Specifications.- Five.- 5.1 Materials Suppliers.- 5.2 Materials Supplier Listing.- 5.3 Equipment Suppliers.- 5.4 Test, Inspection & Repair Equipment Suppliers.- 5.5 Equipment Supplier Listing.


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Product Details
  • ISBN-13: 9780442014285
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Height: 229 mm
  • Returnable: N
  • Weight: 907 gr
  • ISBN-10: 0442014287
  • Publisher Date: /04/1993
  • Binding: Hardback
  • Language: English
  • Sub Title: Manufacturing Science and Technology
  • Width: 292 mm


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