Buy Industry Standard FDSOI Compact Model BSIM-IMG for IC Design
close menu
Bookswagon
search
My Account
Home > Industry and industrial studies > Manufacturing industries > Industry Standard FDSOI Compact Model BSIM-IMG for IC Design: (Woodhead Publishing Series in Electronic and Optical Materials)
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design: (Woodhead Publishing Series in Electronic and Optical Materials)

Industry Standard FDSOI Compact Model BSIM-IMG for IC Design: (Woodhead Publishing Series in Electronic and Optical Materials)


     0     
5
4
3
2
1



International Edition


X
About the Book

Industry standard FDSOI compact model BSIM-IMG for IC design

Table of Contents:
1. Fully Depleted Silicon on Oxide Transistor and Compact Model 2. Core Model for Independent Multigate MOSFETs 3. Channel Current Model With Real Device Effects in BSIM-IMG 4. Leakage Current and Thermal Effects 5. Model for Terminal Charges and Capacitances in BSIM-IMG6. Parameter Extraction With BSIM-IMG Compact Model 7. Testing BSIM-IMG Model Quality 8. High-Frequency and Noise Models in BSIM-IMG

About the Author :
Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California Berkeley, United States. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica. He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley’s highest honor for teaching – the Berkeley Distinguished Teaching Award. Sourabh Khandelwal is an Associate Professor at Macquarie University. He is the lead author of two industry standard compact models: ASM-HEMT for GaN RF and power technology, and ASM-ESD for silicon ESD applications. He has also co-authored BSIM-CMG, BSIM-IMG and BSIM6 compact models during his tenure at the BSIM group at the University of California Berkeley. Dr Khandelwal has published 3 books and over 150 research papers. He regularly serves as consultant to multi-national semiconductor companies. Yogesh Singh Chauhan is a Chair Professor in the Department of Electrical Engineering at the Indian Institute of Technology Kanpur, India. He is the developer of several industry standard models: ASM-HEMT, BSIM-BULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4 and BSIM-SOI models. His research group is involved in developing compact models for GaN transistors, FinFET, nanosheet/gate-all-around FETs, FDSOI transistors, negative capacitance FETs and 2D FETs. His research interests are RF characterization, modeling, and simulation of semiconductor devices. Director of RF Innovation at Globalfoundries, USA Principal Member of Technical Staff at Globalfoundries USA Juan Pablo Duarte Sepúlveda obtained his Ph.D. at the University of California, Berkeley in 2018. He received his B.Sc. in 2010 and his M.Sc. in 2012, both in electrical engineering from the Korea Advanced Institute of Science and Technology (KAIST). He held a position as a lecturer at the Universidad Tecnica Federico Santa Maria, Valparaiso, Chile, in 2012. He has authored many papers on nanoscale semiconductor device modeling and characterization. He received the Best Student Paper Award at the 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) for the paper: Unified FinFET Compact Model: Modelling Trapezoidal Triple-Gate FinFETs. Pragya Kushwaha is currently a Postdoctoral Researcher with Prof. Chenming Hu in the BSIM Device Modeling Group at University of California, Berkeley. She received her PhD degree from Indian Institute of Technology Kanpur, India in 2017. She has authored several national and international research papers in the area of semiconductor device modeling and characterization. During her PhD, she has developed a complete RF compact model for FDSOI transistors under the frame work of industry standard BSIM-IMG compact model. Her current research interests include modeling, simulation, and characterization of advanced semiconductor devices such as nanowires, NCFETs, PD/FDSOIs, FinFETs, tunnel FETs, high-voltage FETs, and bulk MOSFETs. Harshit Agarwal received the PhD degree from Indian Institute of Technology Kanpur, India in 2017. He is currently working as center manager and post-doc fellow at Berkeley Device Modeling Centre, BSIM group, University of California Berkeley, Berkeley, USA. He has been involved in the development of multi-gate and bulk MOSFET models. He is also involved in the modeling and characterization of advanced steep sub-threshold slope devices like negative capacitance FETs, tunnel FET etc. He has authored several papers in the field of semiconductor device modeling, simulation and characterization.


Best Sellers


Product Details
  • ISBN-13: 9780081024010
  • Publisher: Elsevier Science & Technology
  • Publisher Imprint: Woodhead Publishing Ltd
  • Height: 229 mm
  • No of Pages: 258
  • Weight: 403 gr
  • ISBN-10: 0081024010
  • Publisher Date: 22 May 2019
  • Binding: Paperback
  • Language: English
  • Series Title: Woodhead Publishing Series in Electronic and Optical Materials
  • Width: 152 mm


Similar Products

Add Photo
Add Photo

Customer Reviews

REVIEWS      0     
Click Here To Be The First to Review this Product
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design: (Woodhead Publishing Series in Electronic and Optical Materials)
Elsevier Science & Technology -
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design: (Woodhead Publishing Series in Electronic and Optical Materials)
Writing guidlines
We want to publish your review, so please:
  • keep your review on the product. Review's that defame author's character will be rejected.
  • Keep your review focused on the product.
  • Avoid writing about customer service. contact us instead if you have issue requiring immediate attention.
  • Refrain from mentioning competitors or the specific price you paid for the product.
  • Do not include any personally identifiable information, such as full names.

Industry Standard FDSOI Compact Model BSIM-IMG for IC Design: (Woodhead Publishing Series in Electronic and Optical Materials)

Required fields are marked with *

Review Title*
Review
    Add Photo Add up to 6 photos
    Would you recommend this product to a friend?
    Tag this Book Read more
    Does your review contain spoilers?
    What type of reader best describes you?
    I agree to the terms & conditions
    You may receive emails regarding this submission. Any emails will include the ability to opt-out of future communications.

    CUSTOMER RATINGS AND REVIEWS AND QUESTIONS AND ANSWERS TERMS OF USE

    These Terms of Use govern your conduct associated with the Customer Ratings and Reviews and/or Questions and Answers service offered by Bookswagon (the "CRR Service").


    By submitting any content to Bookswagon, you guarantee that:
    • You are the sole author and owner of the intellectual property rights in the content;
    • All "moral rights" that you may have in such content have been voluntarily waived by you;
    • All content that you post is accurate;
    • You are at least 13 years old;
    • Use of the content you supply does not violate these Terms of Use and will not cause injury to any person or entity.
    You further agree that you may not submit any content:
    • That is known by you to be false, inaccurate or misleading;
    • That infringes any third party's copyright, patent, trademark, trade secret or other proprietary rights or rights of publicity or privacy;
    • That violates any law, statute, ordinance or regulation (including, but not limited to, those governing, consumer protection, unfair competition, anti-discrimination or false advertising);
    • That is, or may reasonably be considered to be, defamatory, libelous, hateful, racially or religiously biased or offensive, unlawfully threatening or unlawfully harassing to any individual, partnership or corporation;
    • For which you were compensated or granted any consideration by any unapproved third party;
    • That includes any information that references other websites, addresses, email addresses, contact information or phone numbers;
    • That contains any computer viruses, worms or other potentially damaging computer programs or files.
    You agree to indemnify and hold Bookswagon (and its officers, directors, agents, subsidiaries, joint ventures, employees and third-party service providers, including but not limited to Bazaarvoice, Inc.), harmless from all claims, demands, and damages (actual and consequential) of every kind and nature, known and unknown including reasonable attorneys' fees, arising out of a breach of your representations and warranties set forth above, or your violation of any law or the rights of a third party.


    For any content that you submit, you grant Bookswagon a perpetual, irrevocable, royalty-free, transferable right and license to use, copy, modify, delete in its entirety, adapt, publish, translate, create derivative works from and/or sell, transfer, and/or distribute such content and/or incorporate such content into any form, medium or technology throughout the world without compensation to you. Additionally,  Bookswagon may transfer or share any personal information that you submit with its third-party service providers, including but not limited to Bazaarvoice, Inc. in accordance with  Privacy Policy


    All content that you submit may be used at Bookswagon's sole discretion. Bookswagon reserves the right to change, condense, withhold publication, remove or delete any content on Bookswagon's website that Bookswagon deems, in its sole discretion, to violate the content guidelines or any other provision of these Terms of Use.  Bookswagon does not guarantee that you will have any recourse through Bookswagon to edit or delete any content you have submitted. Ratings and written comments are generally posted within two to four business days. However, Bookswagon reserves the right to remove or to refuse to post any submission to the extent authorized by law. You acknowledge that you, not Bookswagon, are responsible for the contents of your submission. None of the content that you submit shall be subject to any obligation of confidence on the part of Bookswagon, its agents, subsidiaries, affiliates, partners or third party service providers (including but not limited to Bazaarvoice, Inc.)and their respective directors, officers and employees.

    Accept

    Fresh on the Shelf


    Inspired by your browsing history


    Your review has been submitted!

    You've already reviewed this product!
    Your IP: 216.73.217.86 IN