Buy books written by Y.W. Mai Available at Bookswagon UAE
Y.W. Mai

Y.W. Mai

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1.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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2.
Composite Technologies for 2020
4.8 (8)
AED1,375
Binding:
Hardback
Release:
01 Jun 2004
Language:
English
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3.
Fracture Mechanics of Cementitious Materials
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AED22
Binding:
Digital (delivered electronically)
Release:
28 Dec 1995
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4.
Composite Technologies for 2020
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AED144
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Release:
01 Jan 2004
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5.
Fracture Mechanics of Cementitious Materials
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AED304
Binding:
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Release:
28 Dec 1995
Language:
English
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6.
Fracture Mechanics of Cementitious Materials
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AED304
Binding:
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Release:
28 Dec 1995
Language:
English
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7.
Polymer Nanocomposites
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AED813
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Release:
28 Feb 2006
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8.
Fracture Mechanics of Cementitious Materials
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AED776
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Release:
04 Nov 2005
Language:
English
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9.
Fracture Mechanics of Cementitious Materials
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AED776
Binding:
Digital (delivered electronically)
Release:
04 Nov 2005
Language:
English
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10.
Fracture Mechanics of Cementitious Materials
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AED776
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Digital (delivered electronically)
Release:
04 Nov 2005
Language:
English
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11.
Fracture Mechanics of Cementitious Materials
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AED776
Binding:
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Release:
04 Nov 2005
Language:
English
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12.
On the Rate of Slow Cracking of Materials
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AED185
Binding:
Paperback
Release:
27 Jan 2017
Language:
English
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13.
On the Rate of Slow Cracking of Materials
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AED41
Binding:
Hardback
Release:
27 Jan 2017
Language:
English
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14.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Publisher: Elsevier Science
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AED892
Binding:
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Release:
01 Jan 2015
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15.
Physical Properties and Applications of Polymer Nanocomposites
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AED119
Binding:
Hardback
Release:
29 Oct 2010
Language:
English
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16.
Polymer Nanocomposites
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AED855
Binding:
Hardback
Release:
15 Nov 2010
Language:
English
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17.
Fracture Mechanics of Cementitious Materials
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AED930
Binding:
Digital (delivered electronically)
Release:
28 Dec 1995
Language:
English
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18.
Failure of Electronic Packaging
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AED600
Binding:
Hardback
Release:
15 Jun 2010
Language:
English
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