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Ting Y Tsui

Ting Y Tsui

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Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects
Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects
By: Ting Y Tsui
Publisher: Materials Research Society
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AED1,087
Binding:
Hardback
Release:
01 Jan 2006
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