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Rupal Jain

Rupal JainRupal Jain brings a wealth of experience in engineering, program management, strategic alignment and stands as a prominent individual in the realm of electronics and semiconductor chip manufacturing. She has orchestrated projects spanning the ntire spectrum from design conception, quality to final delivery on a global scale, covering regions such as the USA, Italy, Taiwan, Singapore, Malaysia, China, and India. Recognized for her profound expertise, Rupal is celebrated by prestigious certifications such as PMP, CSM, and Lean Six Sigma Black Belt. She holds a master’s in electrical and Electronics Engineering from NTU Singapore, in a joint degree program with TUM Germany. Her contributions have garnered international acclaim, earning her invitations to esteemed publications and coveted awards. Read More Read Less

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1.
How to be a Good Teacher
Publisher: Pustak Mahal
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AED42
Binding:
Paperback
Release:
01 Jun 2013
Language:
English
Available
Ships within 4-6 Days Explain..
2.
Mastering Project Management
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AED133
Binding:
Paperback
Release:
28 Aug 2024
Language:
English
International Edition
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3.
Advancements in AI and IoT for Chip Manufacturing and Defect Prevention
Publisher: River Publishers
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AED257
Binding:
Paperback
Release:
25 Nov 2024
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Semiconductor Essentials
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AED79
Binding:
Paperback
Release:
12 Jun 2024
Language:
English
International Edition
Ships within 10-12 Days Explain..
5.
Disability is NOT Inability
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AED141
Binding:
Paperback
Release:
23 Sep 2018
Language:
English
International Edition
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6.
Mastering Project Management
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AED63
Binding:
Digital (delivered electronically)
Release:
28 Aug 2024
Language:
English
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7.
Learn the Qualities of Leadership :
Publisher: Pustak Mahal
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AED8
Binding:
Paperback
Release:
03 Apr 2017
Language:
English
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8.
Advancements in AI and IoT for Chip Manufacturing and Defect Prevention
Publisher: River Publishers
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AED301
Binding:
Digital (delivered electronically)
Release:
25 Nov 2024
Language:
English
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9.
Advancements in AI and IoT for Chip Manufacturing and Defect Prevention
No Review Yet
AED301
Binding:
Digital (delivered electronically)
Release:
25 Nov 2024
Language:
English
Out of Stock
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