Books written by Packaging IEEE Components Bookswagon UAE
Packaging IEEE Components

Packaging IEEE Components

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1.
Fifteenth International Conference on Thermoelectrics
Publisher: I.E.E.E.Press
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AED600
Binding:
Paperback
Release:
01 Sep 1996
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2.
Sixth Biennial IEEE International Nonvolatile Memory Technology Conference
Publisher: I.E.E.E.Press
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AED422
Binding:
Paperback
Release:
01 Jan 1997
Language:
English
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3.
Electrical Performance of Electronic Packaging
Publisher: I.E.E.E.Press
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AED73
Binding:
Paperback
Release:
01 Nov 1996
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4.
1995 Japan Iemt Symposium
Publisher: I.E.E.E.Press
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AED57
Binding:
Paperback
Release:
01 Sep 1996
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5.
Nineteenth IEEE/Cpmt International Electronics Manufacturing Technology Symposium, October 14-16, 1996, Austin, Tx, USA
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6.
1999 7th International Symposium on the Physical Failure Analysis of Integrated Circuits
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7.
Electrical Performance of Electronic Packaging
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8.
Electrical Performance of Electronic Packaging
Publisher: I.E.E.E.Press
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AED538
Binding:
Paperback
Release:
01 Dec 1999
Language:
English
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9.
2000 4th International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing
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10.
Electrical Performance of Electronic Packaging
Publisher: I.E.E.E.Press
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AED434
Binding:
Paperback
Release:
01 Jan 1998
Language:
English
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11.
International Advanced Packaging Materials Symposium
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12.
Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop
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13.
1996 42nd Holm Conference on Electrical Contacts
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