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Packaging IEEE Components

Packaging IEEE Components

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1.
Sixth Biennial IEEE International Nonvolatile Memory Technology Conference
Publisher: I.E.E.E.Press
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AED388
Binding:
Paperback
Release:
01 Jan 1997
Language:
English
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2.
Nineteenth IEEE/Cpmt International Electronics Manufacturing Technology Symposium, October 14-16, 1996, Austin, Tx, USA
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3.
Fifteenth International Conference on Thermoelectrics
Publisher: I.E.E.E.Press
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AED552
Binding:
Paperback
Release:
01 Sep 1996
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4.
1999 7th International Symposium on the Physical Failure Analysis of Integrated Circuits
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5.
1996 42nd Holm Conference on Electrical Contacts
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6.
Electrical Performance of Electronic Packaging
Publisher: I.E.E.E.Press
No Review Yet
AED399
Binding:
Paperback
Release:
01 Jan 1998
Language:
English
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7.
2000 4th International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing
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8.
Electrical Performance of Electronic Packaging
Publisher: I.E.E.E.Press
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AED495
Binding:
Paperback
Release:
01 Dec 1999
Language:
English
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9.
Electrical Performance of Electronic Packaging
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10.
Electrical Performance of Electronic Packaging
Publisher: I.E.E.E.Press
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AED68
Binding:
Paperback
Release:
01 Nov 1996
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11.
1995 Japan Iemt Symposium
Publisher: I.E.E.E.Press
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AED52
Binding:
Paperback
Release:
01 Sep 1996
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12.
International Advanced Packaging Materials Symposium
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13.
Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop
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