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Morgan J. ChenMorgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

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Lcp for Microwave Packages and Modules

By: Kunia Aihara, Anh-Vu H Pham (University of California, Davis), Staff Morgan J Chen

Publisher: Not Avail

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AED44

Binding:	Digital (delivered electronically)
Release:	31 May 2012

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LCP for Microwave Packages and Modules

By: Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara

Publisher: Cambridge University Press

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AED586

Binding:	Digital download and online
Release:	05 Jul 2012
Language:	English

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Lcp for Microwave Packages and Modules

By: Kunia Aihara, Anh-Vu H Pham (University of California, Davis), Staff RF Engineer Morgan J Chen

Publisher: Cambridge University Press

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AED69

Binding:	Graphic Novel
Release:	01 Jan 2012

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