Mikhail Baklanov

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Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2011: Volume 1335

By: Mikhail R. Baklanov, Shinichi Ogawa, Geraud DuBois, Christian Dussarrat, Terukazu Kokubo

Publisher: Materials Research Society

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AED351

Binding:	Hardback
Release:	21 Nov 2011
Language:	English

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Advanced Interconnects for ULSI Technology

By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho

Publisher: John Wiley & Sons Inc

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AED568

Binding:	Hardback
Release:	02 Mar 2012
Language:	English

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Dielectric Films for Advanced Microelectronics

By: Mikhail Baklanov, Karen Maex, Martin Green

Publisher: John Wiley & Sons Inc

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AED1,064

Binding:	Hardback
Release:	09 Feb 2007
Language:	English

International Edition

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Advanced Interconnects for ULSI Technology

By: Ehrenfried Zschech, Mikhail Baklanov (IMEC, Belgium IMEC IMEC IMEC IMEC, Belgium IMEC IMEC IMEC IMEC, Belgium IMEC IMEC IMEC IMEC, Belgium IMEC, Belgium IMEC, Belgium IMEC, Belgium IMEC IMEC IMEC IMEC IMEC IMEC IMEC, Belgium IMEC, Belgium IMEC, Belgium IMEC IMEC IMEC IMEC IM, Paul S Ho (University of Texas at Austin University of Texas, Austin University of Texas at Austin University of Texas at Austin University of Texas at Austin University of Texas at Austin IBM T J Watson Research Center, New York University of Texas, Aust

Publisher: John Wiley & Sons

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AED0

Binding:	Digital (delivered electronically)
Release:	17 Feb 2012

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Dielectric Films for Advanced Microelectronics

By: Mikhail Baklanov, Karen Maex, Martin Green

Publisher: John Wiley & Sons Inc

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AED1,029

Binding:	Digital (delivered electronically)
Release:	04 Apr 2007
Language:	English

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Advanced Interconnects for ULSI Technology

By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho

Publisher: John Wiley & Sons Inc

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AED731

Binding:	Digital (delivered electronically)
Release:	17 Feb 2012
Language:	English

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Advanced Interconnects for ULSI Technology

By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho

Publisher: John Wiley & Sons Inc

No Review Yet

AED54

Binding:	Digital (delivered electronically)
Release:	17 Feb 2012
Language:	English

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Advanced Interconnects for ULSI Technology

By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho

Publisher: John Wiley & Sons Inc

No Review Yet

AED731

Binding:	Digital (delivered electronically)
Release:	17 Feb 2012
Language:	English

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Dielectric Films for Advanced Microelectronics

By: Mikhail Baklanov, Karen Maex, Martin Green

Publisher: John Wiley and Sons Ltd

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AED514

Binding:	Other digital
Release:	19 Mar 2007
Language:	English

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10.

Dielectric Films for Advanced Microelectronics

By: Karen Maex, Martin Green , Mikhail Baklanov (IMEC, Belgium IMEC IMEC IMEC IMEC, Belgium IMEC IMEC IMEC IMEC, Belgium IMEC IMEC IMEC IMEC, Belgium IMEC, Belgium IMEC, Belgium IMEC, Belgium IMEC IMEC IMEC IMEC IMEC IMEC IMEC, Belgium IMEC, Belgium IMEC, Belgium IMEC IMEC IMEC IMEC IM

Publisher: Wiley

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AED987

Binding:	Digital (delivered electronically)
Release:	01 Jan 2007

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