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Krishna Tunga

Krishna Tunga

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1.
Study of SnAgCu Alloy Reliability
Publisher: VDM Verlag
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AED286
Binding:
Paperback
Release:
15 Mar 2009
Language:
English
International Edition
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2.
Study of Tin-Silver-Copper Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry
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