Buy books written by John W. Balde Available at Bookswagon
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John W. Balde

John W. Balde

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1.
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology
By: John W. Balde
Publisher: Kluwer Academic Publishers
No Review Yet
AED389
Binding:
Hardback
Release:
31 Jan 2003
Language:
English
Available
Ships within 10-12 Days Explain..
2.
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology
By: John W. Balde
Publisher: Springer-Verlag New York Inc.
No Review Yet
AED488
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology
By: John W Balde
Publisher: Springer
No Review Yet
AED88
Binding:
Paperback
Release:
01 Sep 2014
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