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Jeffrey C Suhling

Jeffrey C Suhling

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Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
By: Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay
Publisher: World Scientific Publishing Co Pte Ltd
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AED6,601
Binding:
Hardback
Release:
18 Oct 2019
Language:
English
Available
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