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1.
Materials in Microelectronic and Optoelectronic Packaging
Materials in Microelectronic and Optoelectronic Packaging
By: Hung C. Ling
Publisher: American Ceramic Society
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AED318
Binding:
Paperback
Release:
/12/1993
Out of Stock
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2.
Materials and Processes for Wireless Communications
Materials and Processes for Wireless Communications
By: T. Negas, Hung C. Ling, Hung Ling
Publisher: American Ceramic Society
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AED307
Binding:
Hardback
Release:
01 Jan 1995
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