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1.
Topological Optimization of Buckling
Topological Optimization of Buckling
By: Bingchuan Bian, Huazhong University of Science and Technology
Publisher: De Gruyter
No Review Yet
AED609
Binding:
Hardback
Release:
24 Sep 2018
Language:
English
Available
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2.
Led Packaging for Lighting Applications
Led Packaging for Lighting Applications
By: Sheng Liu (Huazhong University of Science and Technology, Wuhan, Hubei, China), Xiaobing Luo (Huazhong University of Science and Technology, Wuhan, Hubei, China)
Publisher: Wiley
No Review Yet
AED572
Binding:
Digital (delivered electronically)
Release:
01 Jan 2011
Out of Stock
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3.
Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures
Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures
By: Sheng Liu (Huazhong University of Science and Technology, Wuhan, Hubei, China)
Publisher: American Society of Mechanical Engineers
No Review Yet
AED369
Binding:
Hardback
Release:
01 Jan 1998
Out of Stock
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4.
Methods for Generating Addressable Focus Cues in Stereoscopic Displays
Methods for Generating Addressable Focus Cues in Stereoscopic Displays
By: Sheng Liu (Huazhong University of Science and Technology, Wuhan, Hubei, China)
Publisher: Proquest, Umi Dissertation Publishing
No Review Yet
AED69
Binding:
Paperback
Release:
01 Sep 2011
Out of Stock
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5.
Low Temperature Plasma Technology
Low Temperature Plasma Technology
By: Paul K Chu (City University of Hong Kong City University of Hong Kong, Kowloon City University of Hong Kong, Kowloon City University of Hong Kong City University of Hong Kong City University of Hong Kong City University of Hong Kong City University of Hon, Xinpei Lu (HuaZhong University of Science & Technology, HuBei, P.R. China)
Publisher: CRC Press
No Review Yet
AED644
Binding:
Undefined
Release:
01 Jan 2013
Out of Stock
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6.
Absolute Stability of Nonlinear Control Systems
Absolute Stability of Nonlinear Control Systems
By: P Yu (University of Western Ontario), X Liao (Huazhong University of Science and Technology Hubei, China)
Publisher: Springer
No Review Yet
AED486
Binding:
Graphic Novel
Release:
01 Jan 2008
Out of Stock
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7.
Topological Optimization of Buckling
Topological Optimization of Buckling
By: Bingchuan Bian, Huazhong University of Science and Technology
Publisher: De Gruyter
No Review Yet
AED66
Binding:
Digital (delivered electronically)
Release:
24 Sep 2018
Language:
English
Out of Stock
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8.
Topological Optimization of Buckling
Topological Optimization of Buckling
By: Bingchuan Bian, Huazhong University of Science and Technology
Publisher: De Gruyter
No Review Yet
AED840
Binding:
Digital (delivered electronically)
Release:
24 Sep 2018
Language:
English
Out of Stock
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9.
Wafer Fabrication
Wafer Fabrication
By: Jie Zhang, Huazhong University of Science and Technology
Publisher: De Gruyter
No Review Yet
AED840
Binding:
Digital (delivered electronically)
Release:
24 Sep 2018
Language:
English
Out of Stock
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10.
Wafer Fabrication
Wafer Fabrication
By: Jie Zhang, Huazhong University of Science and Technology
Publisher: De Gruyter
No Review Yet
AED840
Binding:
Digital (delivered electronically)
Release:
24 Sep 2018
Language:
English
Out of Stock
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11.
LOGO Recognition
LOGO Recognition
By: Lizhe Wang (Center for Earth Observation, Chinese Academy of Science Center for Earth Observation and Digital Earth, Chinese Academy of Science, Beijing, People???s Republic of China Institute of Scientific Computing, Germany), Dan Chen (School of Computer Science, China University of Geosciences, China, and University of Birmingham, UK China University of Geosciences, Wuhan, People???s Republic of China China University of Geosciences, Wuhan, People???s Republic of China), Jingying Chen (Huazhong Normal University, Wuhan, China Huazhong Normal University, Wuhan, People???s Republic of China Huazhong Normal University, Wuhan, People???s Republic of China Huazhong Normal University, Wuhan, People???s Republic of China)
Publisher: CRC Press
No Review Yet
AED474
Binding:
Graphic Novel
Release:
01 Jan 2011
Out of Stock
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12.
Large-Scale Simulation
Large-Scale Simulation
By: Lizhe Wang (Center for Earth Observation, Chinese Academy of Science Center for Earth Observation and Digital Earth, Chinese Academy of Science, Beijing, People???s Republic of China Institute of Scientific Computing, Germany), Dan Chen (School of Computer Science, China University of Geosciences, China, and University of Birmingham, UK China University of Geosciences, Wuhan, People???s Republic of China China University of Geosciences, Wuhan, People???s Republic of China), Jingying Chen (Huazhong Normal University, Wuhan, China Huazhong Normal University, Wuhan, People???s Republic of China Huazhong Normal University, Wuhan, People???s Republic of China Huazhong Normal University, Wuhan, People???s Republic of China)
Publisher: CRC Press
No Review Yet
AED571
Binding:
Undefined
Release:
01 Jan 2012
Out of Stock
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13.
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
By: Yong Liu, Sheng Liu (Huazhong University of Science and Technology, Wuhan, Hubei, China)
Publisher: Wiley
No Review Yet
AED592
Binding:
Digital (delivered electronically)
Release:
10 May 2014
Out of Stock
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14.
Green Chemistry and Technologies
Green Chemistry and Technologies
By: Long Zhang, Changsheng Gong, Dai Bin, Huazhong University of Science &
Publisher: De Gruyter
No Review Yet
AED469
Binding:
Digital (delivered electronically)
Release:
24 Sep 2018
Language:
English
Out of Stock
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15.
Green Chemistry and Technologies
Green Chemistry and Technologies
By: Long Zhang, Changsheng Gong, Dai Bin, Huazhong University of Science &
Publisher: De Gruyter
No Review Yet
AED469
Binding:
Digital (delivered electronically)
Release:
24 Sep 2018
Language:
English
Out of Stock
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