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Feng Zhang

Feng ZhangFeng Zhang got his Ph.D. degree in Industrial Engineering from the State University of New York at Buffalo (UB), US, in September of 2018. From Nov. 2018 to Mar. 2019, he worked as a short term Postdoctoral researcher in the department of Mechanical nd Aerospace Engineering with Dr. Deborah Chung. In May of 2019, he joined Nanjing Normal University, and is a member of Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing. He obtained his Bachelor degree from Wuhan University of technology in 2005. After several years’ experience in industry, He attended UB and obtained his master degree in 2014. His current research interests include developing novel 3D printing methods for fabrication of various porous objects. Beginning February of 2019, Dr. Zhang’s Ph.D. topic is supported by the National Science Foundation’s most prestigious award – CAREER.
Dr. Zhang has served as the reviewer for many technique journals, including Rapid Prototyping, Additive Manufacturing, Journal of manufacturing process, Journal of manufacturing science and engineering. His work has been published in many high impact journal such as Nano Energy, Small, ACS Nano, and Nanotechnology.
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1.
Auction Design for the Wireless Spectrum Market
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AED253
Binding:
Paperback
Release:
16 Jun 2014
Language:
English
Available
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2.
Cognitive Wireless Networks
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AED253
Binding:
Paperback
Release:
01 Jun 2015
Language:
English
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3.
5G for Future Wireless Networks
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AED350
Binding:
Paperback
Release:
01 Jan 2018
Language:
English
Available
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4.
Geo-informatics in Sustainable Ecosystem and Society
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AED179
Binding:
Paperback
Release:
27 Feb 2019
Language:
English
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5.
Semiconductor Photovoltaic Cells
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AED805
Binding:
Hardback
Release:
26 Feb 2021
Language:
English
International Edition
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6.
Transactions on Intelligent Welding Manufacturing
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AED1,114
Binding:
Hardback
Release:
10 Dec 2022
Language:
English
International Edition
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7.
Graph Neural Network for Hyperspectral Image Clustering
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AED759
Binding:
Hardback
Release:
10 Aug 2025
Language:
English
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8.
Metaverse – METAVERSE 2025
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AED260
Binding:
Paperback
Release:
22 Sep 2025
Language:
English
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9.
Semiconductor Quantum Dots
Publisher: Mdpi AG
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AED241
Binding:
Hardback
Release:
27 Jun 2025
Language:
English
International Edition
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10.
Pharmaceutical Extrusion Technology
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AED136
Binding:
Hardback
Release:
14 May 2003
Language:
English
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11.
Proceedings of the 2025 China National Conference on Terahertz Biophysics
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