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Dominic Schepis

Dominic Schepis

Dominic Schepis has over 35 years of experience in the semiconductor industry supporting logic and memory technologies. As a Principal Member of the Technical Staff at GlobalFoundries, Dominic worked on process development and integration for arious advanced node CMOS technologies. His early work on SOI CMOS integration was instrumental to bringing this technology for use in IBM servers. He also was appointed Master Inventor at both IBM and GlobalFoundries and served on their patent evaluation boards. A graduate from Rensselaer Polytechnic Institute, he joined IBM’s Semiconductor Research and Development Center (SRDC) and has worked on a variety of advanced research and development projects and supported process sectors including reactive ion etching, epitaxial film growth, process integration, and other unit processes. During his tenure there, he coauthored over 29 technical journal papers and has over 100 issued US patents.

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Handbook of Thin Film Deposition
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AED553
Binding:
Paperback
Release:
24 Oct 2024
Language:
English
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