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1.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
By: E. Todd Ryan, Wen-Li Wu, Qinghuang Lin, Do Yeung Yoon
Publisher: Cambridge University Press
No Review Yet
AED392
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
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2.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
By: E. Todd Ryan, Wen-Li Wu, Qinghuang Lin, Do Yeung Yoon
Publisher: Materials Research Society
No Review Yet
AED329
Binding:
Hardback
Release:
12 Sep 2007
Language:
English
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